SHINDO COMPANY, LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
A43C FASTENINGS OR ATTACHMENTS FOR FOOTWEAR; LACES IN GENERAL117
 
  
 
A44B BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE 130
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
D03D WOVEN FABRICS; METHODS OF WEAVING; LOOMS132
 
  
 
D04C BRAIDING OR MANUFACTURE OF LACE, INCLUDING BOBBIN-NET OR CARBONISED LACE; BRAIDING MACHINES; BRAID; LACE 111

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7038325 Wiring tape for semiconductor device including a buffer layer having interconnected foamsApr 23, 04May 02, 06[H01L]
6433440 Semiconductor device having a porous buffer layer for semiconductor deviceJun 05, 98Aug 13, 02[H01L]
5837154 Method of manufacturing double-sided circuit tape carrierApr 23, 97Nov 17, 98[B44C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0001,633 LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGEAbandonedJun 11, 12Jan 03, 13[H01L]
2012/0002,420 LED module, LED package, and wiring substrate and method of making sameAbandonedJun 22, 11Jan 05, 12[F21V, H01K, F21S, H05K]
2010/0148,207 SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE AND ITS MANUFACTURING METHODAbandonedMay 14, 08Jun 17, 10[H01L]
7355278 Mold die for a semiconductor deviceExpiredMar 11, 04Apr 08, 08[H01L]
7213335 Method for manufacturing printed circuit boardsExpiredMar 01, 04May 08, 07[H01K]
6953991 Semiconductor deviceExpiredJun 01, 01Oct 11, 05[H01L]

Top Inventors for This Owner

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