SHENGYI TECHNOLOGY CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 36120
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 3383
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM30127
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 2850
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2199
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 1389
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 587
 
  
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 352
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 272
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0050,515 ACTIVE ESTER, THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATED BOARD CONTAINING SAMESep 21, 15Feb 22, 18[C08J, C08G, C08L, B32B, H05K]
2018/0037,736 RESIN COMPOSITION AND PRE-PREG AND LAMINATE USING THE COMPOSITIONSep 18, 15Feb 08, 18[C08J, C08L, B32B]
2017/0009,074 HALOGEN-FREE FLAME RETARDANT TYPE RESIN COMPOSITIONFeb 11, 15Jan 12, 17[C08J, C08L, B32B, H05K]
2016/0272,808 HALOGEN-FREE RESIN COMPOSITION AND USES THEREOFJul 17, 14Sep 22, 16[C08J, C09D, C08L]
2016/0255,718 AN EPOXY RESIN COMPOSITION, AND PREPREG AND COPPER-CLAD LAMINATE MADE BY USING SAMEAug 13, 14Sep 01, 16[C08J, C08G, C08L, H05K, B32B]
2016/0243,798 THERMOSETTING RESIN SANDWICH PREPREG, PREPARATION METHOD THEREOF AND COPPER CLAD LAMINATE THEREFROMJun 10, 14Aug 25, 16[B32B, H05K]
2016/0244,471 PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOFJun 13, 14Aug 25, 16[C08J, C09K, C07F, C08G, C08L, H05K]
2016/0115,313 CYANATE RESIN COMPOSITION AND USE THEREOFMay 30, 13Apr 28, 16[C08J, C08L, H05K]
2016/0108,230 CYANATE RESIN COMPOSITION AND USE THEREOFMay 30, 13Apr 21, 16[C08J, C08L, H05K, B32B]
2016/0007,452 CIRCUIT SUBSTRATE AND PROCESS FOR PREPARING THE SAMEFeb 19, 14Jan 07, 16[C03C, H05K]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9873789 Halogen-free epoxy resin composition, prepreg and laminate using sameJun 01, 15Jan 23, 18[C08J, C08G, C08L, H05K]
9840620 Halogen-free resin composition and uses thereofMar 21, 14Dec 12, 17[C08J, C08G, C08L, B32B, H05K]
9771479 Halogen-free resin composition and use thereofMar 21, 14Sep 26, 17[C09J, C08G, C09D, C08L, B32B, C08K, H05K]
9752028 Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the sameApr 06, 15Sep 05, 17[C08G, C08L, C08K]
9744745 Circuit substrate and manufacturing method thereofDec 29, 11Aug 29, 17[H05K, B32B]
9745464 Halogen-free flame retardant resin composition and the use thereofFeb 07, 13Aug 29, 17[C08J, C08G, C08L, H05K, B32B]
9725565 Flexible metal laminate and preparation method of the sameSep 30, 14Aug 08, 17[C08J, B05D, C08L, B32B]
9670362 Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefromDec 29, 11Jun 06, 17[C08J, C08L, C08K]
9611377 Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the sameApr 07, 15Apr 04, 17[C08J, C08G, B32B, C08K]
9493651 Halogen-free resin composition, and prepreg and laminate for printed circuits using the sameDec 08, 14Nov 15, 16[C08L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0185,952 Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the SameAbandonedApr 06, 15Jun 30, 16[C08L]
2015/0240,055 EPOXY RESIN COMPOUND AND PREPREG AND COPPER-CLAD LAMINATE MANUFACTURED USING THE COMPOUNDAbandonedSep 14, 12Aug 27, 15[H01B, C08K, B32B]
2014/0377,534 CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOFAbandonedDec 29, 11Dec 25, 14[H05K]
2014/0349,120 Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the SameAbandonedOct 18, 11Nov 27, 14[C08L, H05K]
2014/0342,161 Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the SameAbandonedOct 18, 11Nov 20, 14[C08G, C08L, H05K]
2014/0154,939 HALOGEN-FREE LOW-DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER FOIL LAMINATE MADE BY USING SAMEAbandonedOct 18, 11Jun 05, 14[H05K]

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