SHANGHAI KAIHONG TECHNOLOGY CO., LTD

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8008128 Thin quad flat package with no leads (QFN) fabrication methodsMar 22, 10Aug 30, 11[H01L]
7834433 Semiconductor power deviceJul 16, 07Nov 16, 10[H01L]
7745261 Chip scale package fabrication methodsApr 25, 08Jun 29, 10[H01L]
7713784 Thin quad flat package with no leads (QFN) fabrication methodsApr 25, 08May 11, 10[H01L]
7682874 Chip scale package (CSP) assembly apparatus and methodJul 10, 06Mar 23, 10[H01L]
7402459 Quad flat no-lead (QFN) chip package assembly apparatus and methodJul 10, 06Jul 22, 08[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0281,398 THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODSAbandonedJul 21, 11Nov 17, 11[H01L]
7517726 Wire bonded chip scale package fabrication methodsExpiredApr 25, 08Apr 14, 09[H01L]

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