SEMBLANT LIMITED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 193

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0094,810 COATED ELECTRICAL ASSEMBLYSep 15, 16Mar 30, 17[C23C, H05K]
2012/0257,364 Coated Electrical AssemblyJun 19, 12Oct 11, 12[B05D, B32B, H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9055700 Apparatus with a multi-layer coating and method of forming the sameAug 11, 09Jun 09, 15[H01L, H01H, H05K]
8995146 Electrical assembly and methodJun 19, 12Mar 31, 15[H05K]
8618420 Apparatus with a wire bond and method of forming the sameFeb 18, 11Dec 31, 13[H05K]
8492898 Printed circuit boardsFeb 18, 08Jul 23, 13[H01L, H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0240,256 Method for Reducing Creep CorrosionAbandonedNov 09, 11Sep 19, 13[H05K]

Top Inventors for This Owner

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