SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0179,101 BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIEMar 01, 17Jun 22, 17[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9773766 Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieJan 09, 13Sep 26, 17[H01L]
9704797 Waterfall wire bondingMay 18, 11Jul 11, 17[H01L]
9595454 Semiconductor device including electromagnetic absorption and shieldingApr 26, 12Mar 14, 17[H01L, H05K]
9362244 Wire tail connector for a semiconductor deviceOct 22, 12Jun 07, 16[H01L]
9331045 Semiconductor die laminating device with independent drivesMay 07, 12May 03, 16[H01L]
9240393 High yield semiconductor deviceAug 01, 14Jan 19, 16[H01L]
9230942 Semiconductor device including alternating stepped semiconductor die stacksFeb 26, 13Jan 05, 16[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0086,827 METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBYAbandonedDec 04, 15Mar 24, 16[H01L]
2015/0187,745 SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIEAbandonedDec 05, 14Jul 02, 15[H01L]
2015/0155,247 BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIEAbandonedNov 18, 14Jun 04, 15[H01L]
2012/0146,247 PRE-TREATMENT OF MEMORY CARDS FOR BINDING GLUE AND OTHER CURABLE FLUIDSAbandonedJun 08, 11Jun 14, 12[H01L]

Top Inventors for This Owner

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