RISING SILICON, INCORPORATED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G11C STATIC STORES 18133
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8097872 Modifiable gate stack memory elementFeb 20, 07Jan 17, 12[H01L]
RE42659 Large-capacity semiconductor memory with improved layout for sub-amplifiers to increase speedJun 07, 07Aug 30, 11[G11C]
7910210 Method of producing a layer arrangement, method of producing an electrical component, layer arrangement, and electrical componentNov 20, 06Mar 22, 11[C23C, B32B]
7881092 Increased switching cycle resistive memory elementJul 24, 07Feb 01, 11[G11C]
RE41379 Large-Capacity semiconductor memory with improved layout for sub-amplifiers to increase operational speedJun 07, 07Jun 15, 10[G11C]
7688670 Semiconductor device with improved power supply control for a plurality of memory arraysJul 01, 08Mar 30, 10[G11C]
7411855 Semiconductor device with improved power supply arrangementMar 27, 07Aug 12, 08[G11C]
7411856 Semiconductor device with improved power supply arrangementMar 27, 07Aug 12, 08[G11C]
RE40356 Large-capacity semiconductor memory with improved layout for sub-amplifiers to increase operational speedJul 08, 05Jun 03, 08[G11C]
7298662 Semiconductor device with power down arrangement for reduce power consumptionJul 11, 06Nov 20, 07[G11C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7701743 Electronic circuit packageExpiredAug 07, 08Apr 20, 10[G11C]
2009/0212,438 INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF MAKING THE SAMEAbandonedFeb 26, 08Aug 27, 09[H01L]
7425763 Electronic circuit packageExpiredMar 07, 07Sep 16, 08[H01L]
7233534 Electronic circuit packageExpiredJul 14, 05Jun 19, 07[G11C]
7120069 Electronic circuit packageExpiredFeb 26, 04Oct 10, 06[G11C]
6894334 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameExpiredMar 03, 03May 17, 05[H01L]
6728904 Electronic circuit packageExpiredFeb 24, 03Apr 27, 04[H01L]
6584004 Electronic circuit packageExpiredFeb 28, 01Jun 24, 03[H01L]
6548847 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AND A TRANSITION-METAL NITRIDE FILM BETWEEN THE ALUMINUM WIRING STRIP AND THE TRANSITION-METAL FILMExpiredJul 09, 01Apr 15, 03[H01L]
6342412 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameExpiredDec 14, 99Jan 29, 02[H01L]
6223273 Electronic circuit packageExpiredMar 18, 99Apr 24, 01[H01L]
6195742 Semiconductor multi-chip moduleExpiredJun 10, 98Feb 27, 01[G06F]
6169324 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameExpiredOct 06, 99Jan 02, 01[H01L]
6127255 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameExpiredOct 03, 97Oct 03, 00[H01L]
5202275 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameExpiredMar 20, 90Apr 13, 93[H01L]

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