REVASUM, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 4827
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 2123
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 129
 
  
 
B25J MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES 157
 
  
 
B26B HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR 136
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C30B SINGLE-CRYSTAL GROWTH 155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9610669 Methods and systems for use in grind spindle alignmentSep 30, 13Apr 04, 17[B24B]
9457446 Methods and systems for use in grind shape control adaptationSep 30, 13Oct 04, 16[B24B]
9393669 Systems and methods of processing substratesJan 11, 13Jul 19, 16[B24B]
9193030 CMP retaining ring with soft retaining ring insertJun 03, 14Nov 24, 15[B24B]
9082713 Method of grinding wafer stacks to provide uniform residual silicon thicknessOct 27, 14Jul 14, 15[H01L]
8968052 Systems and methods of wafer grindingOct 19, 12Mar 03, 15[B24B]
8915771 Method and apparatus for cleaning grinding work chuck using a vacuumDec 27, 12Dec 23, 14[B24B]
8740673 CMP retaining ring with soft retaining ring insertOct 04, 11Jun 03, 14[B24B]
8520222 System and method for in situ monitoring of top wafer thickness in a stack of wafersNov 08, 11Aug 27, 13[G01B]
8182312 CMP system with wireless endpoint detection systemSep 06, 08May 22, 12[B24B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0057,531 Method for grinding wafers by shaping resilient chuck coveringAbandonedAug 27, 12Feb 27, 14[B24B]
2013/0078,812 Wafer Carrier with Flexible Pressure PlateAbandonedSep 23, 11Mar 28, 13[B24B, H01L]
2012/0040,591 Replaceable cover for membrane carrierAbandonedAug 16, 10Feb 16, 12[B24B]
7551979 Robot calibration system and methodExpiredNov 17, 06Jun 23, 09[G06F]
2007/0235,133 Devices and methods for measuring wafer characteristics during semiconductor wafer polishingAbandonedMar 29, 06Oct 11, 07[H01L, C23F]
6885206 Device for supporting thin semiconductor wafersExpiredFeb 11, 03Apr 26, 05[G01R]
6878037 Slurry pump control systemExpiredJul 22, 03Apr 12, 05[B24B]
6866564 Method of backgrinding wafers while leaving backgrinding tape on a chuckExpiredDec 10, 02Mar 15, 05[B24B]
6692339 Combined chemical mechanical planarization and cleaningExpiredNov 03, 00Feb 17, 04[B24B]
6629874 Feature height measurement during CMPExpiredOct 26, 00Oct 07, 03[B24B]
6602121 Pad support apparatus for chemical mechanical planarizationExpiredOct 20, 00Aug 05, 03[B24B]
6595829 Slurry pump control systemExpiredFeb 05, 01Jul 22, 03[B24B]
6527621 Pad retrieval apparatus for chemical mechanical planarizationExpiredOct 20, 00Mar 04, 03[B24B]
6520843 High planarity chemical mechanical planarizationExpiredOct 26, 00Feb 18, 03[B24B]
6514121 Polishing chemical delivery for small head chemical mechanical planarizationExpiredOct 26, 00Feb 04, 03[B24B]
6514129 Multi-action chemical mechanical planarization device and methodExpiredOct 26, 00Feb 04, 03[B24B]
6511368 Spherical drive assembly for chemical mechanical planarizationExpiredOct 26, 00Jan 28, 03[B24B]
6450860 Pad transfer apparatus for chemical mechanical planarizationExpiredOct 20, 00Sep 17, 02[B24B]

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