PLASMA-THERM LLC

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 37325
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 16112
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 232
 
  
 
C03C CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS258
 
  
 
G01L MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE 254
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 131
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
C30B SINGLE-CRYSTAL GROWTH 155
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
  
 
G11B INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER 1137

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0025,311 Method and Apparatus for Plasma Dicing a Semi-conductor WaferOct 06, 16Jan 26, 17[H01J, H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9911654 Method and apparatus for plasma dicing a semi-conductor waferOct 06, 16Mar 06, 18[H01J, H01L]
9711406 Method and apparatus for plasma dicing a semi-conductor waferOct 06, 16Jul 18, 17[H01J, H01L]
RE46339 Method and apparatus for plasma dicing a semi-conductor waferSep 15, 15Mar 14, 17[H01J, H01L]
9564366 Method and apparatus for plasma dicing a semi-conductor waferDec 18, 15Feb 07, 17[H01J, H01L]
9496177 Method and apparatus for plasma dicing a semi-conductor waferMay 26, 15Nov 15, 16[H01J, H01L]
9368404 Method for dicing a substrate with back metalSep 23, 13Jun 14, 16[H01L, B28D]
9343365 Method and apparatus for plasma dicing a semi-conductor waferAug 29, 13May 17, 16[H01J, H01L]
9202720 Method and apparatus for plasma dicing a semi-conductor waferFeb 11, 13Dec 01, 15[H01J, H01L]
9202721 Method and apparatus for plasma dicing a semi-conductor waferFeb 10, 14Dec 01, 15[H01J, H01L]
9202737 Method and apparatus for plasma dicing a semi-conductor waferJun 02, 15Dec 01, 15[H01J, H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0255,297 Method and Apparatus for Plasma Dicing a Semi-conductor WaferAbandonedMay 26, 15Sep 10, 15[H01L]
2015/0243,485 Device for Treating an Object with PlasmaAbandonedJul 22, 13Aug 27, 15[H01J]
2014/0150,246 Apparatus and Method for Carrying SubstratesAbandonedFeb 04, 14Jun 05, 14[B25B]
2007/0217,119 Apparatus and Method for Carrying SubstratesAbandonedMar 05, 07Sep 20, 07[C23C, B23B, H01L]
2007/0175,856 Notch-Free Etching of High Aspect SOI Structures Using A Time Division Multiplex Process and RF Bias ModulationAbandonedApr 16, 07Aug 02, 07[C23C, H01L, C23F]
2006/0006,139 Selection of wavelengths for end point in a time division multiplexed processAbandonedAug 23, 05Jan 12, 06[G01L]
2005/0112,891 Notch-free etching of high aspect SOI structures using a time division multiplex process and RF bias modulationAbandonedOct 18, 04May 26, 05[H01L]
2003/0077,910 Etching of thin damage sensitive layers using high frequency pulsed plasmaAbandonedOct 22, 02Apr 24, 03[C23C, H01L, C23F]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.