PHOENIX PRECISION TECHNOLOGY CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 52310
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 13143
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 5200
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 418
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 3130
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 249
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
F23Q IGNITION 116

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7768119 Carrier structure embedded with semiconductor chipDec 10, 07Aug 03, 10[H01L]
7763969 Structure with semiconductor chips embeded thereinOct 27, 06Jul 27, 10[H01L]
7754538 Packaging substrate structure with electronic components embedded therein and method for manufacturing the sameAug 07, 08Jul 13, 10[H01L]
7754598 Method for manufacturing coreless packaging substrateFeb 05, 08Jul 13, 10[H01L]
7718470 Package substrate and method for fabricating the sameOct 17, 07May 18, 10[H01L]
7719104 Circuit board structure with embedded semiconductor chip and method for fabricating the sameOct 05, 07May 18, 10[H01L]
7719853 Electrically connecting terminal structure of circuit board and manufacturing method thereofJul 20, 07May 18, 10[H05K]
7705446 Package structure having semiconductor chip embedded therein and method for fabricating the sameJul 24, 07Apr 27, 10[H01L]
7705456 Semiconductor package substrateNov 24, 08Apr 27, 10[H01L]
7705471 Conductive bump structure of circuit board and method for forming the sameApr 27, 06Apr 27, 10[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0056,738 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOFAbandonedSep 04, 09Mar 10, 11[C25D, B23K, G03F, H05K]
2010/0096,750 Packaging substrateAbandonedOct 21, 08Apr 22, 10[H01L]
2010/0089,612 Electrical connection element of packaging substrateAbandonedOct 15, 08Apr 15, 10[H01B]
2010/0029,047 METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREINAbandonedJul 28, 09Feb 04, 10[H01L]
2010/0002,406 CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREINAbandonedJul 01, 09Jan 07, 10[H05K]
2009/0308,652 PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOFAbandonedJun 02, 09Dec 17, 09[H01R, H05K]
2009/0294,993 Packaging substrate structureAbandonedMay 28, 08Dec 03, 09[H01L]
7626270 Coreless package substrate with conductive structuresExpiredOct 19, 06Dec 01, 09[H01L, H05K]
7598610 Plate structure having chip embedded therein and the manufacturing method of the sameExpiredJan 04, 07Oct 06, 09[H01L]
2009/0168,380 PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENTAbandonedDec 19, 08Jul 02, 09[H05K]
7546682 Methods for repairing circuit board having defective pre-soldering bumpExpiredNov 21, 06Jun 16, 09[H05K]
2009/0115,045 Stacked package module and method for fabricating the sameAbandonedOct 31, 08May 07, 09[H01L]
2009/0102,050 SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATEAbandonedOct 17, 07Apr 23, 09[H01L]
2009/0102,045 Packaging substrate having capacitor embedded thereinAbandonedOct 17, 08Apr 23, 09[H01L]
2009/0102,039 Package on package structureAbandonedOct 15, 08Apr 23, 09[H01L]
2009/0090,548 CIRCUIT BOARD AND FABRICATION METHOD THEREOFAbandonedOct 09, 08Apr 09, 09[H01R, H01B, H05K]
2009/0085,192 Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereofAbandonedOct 01, 08Apr 02, 09[H01L]
2009/0077,799 Circuit board structure with capacitor embedded therein and method for fabricating the sameAbandonedSep 12, 08Mar 26, 09[H05K]
2009/0071,704 Circuit board and method for fabricating the sameAbandonedSep 19, 08Mar 19, 09[H05K]
2009/0071,699 PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedOct 18, 07Mar 19, 09[H05K]

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