PETER WOLTERS GMBH
Patent Owner
Stats
- 11 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jan 10, 2017 most recent publication
Details
- 11 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 233 Total Citation Count
- Dec 10, 1996 Earliest Filing
- 16 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9539695 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafersOct 01, 08Jan 10, 17[B24B]
9004981 Apparatus for double-sided, grinding machining of flat workpiecesNov 18, 09Apr 14, 15[B24B, B24D]
8512099 Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafersOct 19, 09Aug 20, 13[B24B]
8113913 Method for the simultaneous grinding of a plurality of semiconductor wafersMar 14, 08Feb 14, 12[B24B]
7815489 Method for the simultaneous double-side grinding of a plurality of semiconductor wafersJul 09, 07Oct 19, 10[B24B]
6843704 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystalsJul 08, 02Jan 18, 05[B24B]
6447382 Apparatus for removing semiconductor wafers from within the runner disks of a double-sided polishing machineSep 25, 00Sep 10, 02[B24B]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2012/0293,811 Device and Method for Determining the Position of a Working Surface of a Working DiscAbandonedJan 07, 11Nov 22, 12[G01B]
2012/0220,197 Device and Method for the Double-Sided Processing of Flat Work PiecesAbandonedOct 28, 10Aug 30, 12[B24B]
2012/0052,771 Method For the Material-Removing Machining of Very Thin Work Pieces in a Double Sided Grinding MachineAbandonedApr 01, 10Mar 01, 12[B24B]
2011/0222,071 METHOD FOR MEASURING THE THICKNESS OF A DISCOIDAL WORKPIECEAbandonedAug 29, 09Sep 15, 11[G01B]
7963823 Machining machine with means for acquiring machining parametersExpiredMar 12, 08Jun 21, 11[B24B]
2008/0217,310 METHOD FOR PROFILING THE PERIMETER BORDER OF A SEMICONDUCTOR WAFERAbandonedJun 05, 07Sep 11, 08[B23K]
6866468 Loading and unloading station for a device for the processing of circular flat work-pieces, especially semiconductor wafersExpiredMar 13, 02Mar 15, 05[B65G]
6780083 Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafersExpiredApr 19, 02Aug 24, 04[B24B]
6767276 Holder for flat workpieces, particularly semiconductor wafersExpiredDec 13, 01Jul 27, 04[B24B]
6709323 Holder for flat workpieces, particularly semiconductor wafersExpiredDec 13, 01Mar 23, 04[B24B]
6669540 Chuck means for flat workpieces, in particular semi-conductor wafersExpiredMar 28, 02Dec 30, 03[B24B]
6093091 Holder for flat subjects in particular semiconductor wafersExpiredDec 08, 98Jul 25, 00[B24B]
6050885 Device for the chemical-mechanical polishing of an object, in particular a semiconductor waferExpiredApr 27, 98Apr 18, 00[B24B]
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