Orient Semiconductor Electronics, Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
1402 DATA PROCESSING EQUIPMENT AS WELL AS PERIPHERAL APPARATUS AND DEVICES261
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS198

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8627577 Apparatus of checking dimensions of memory cardDec 26, 11Jan 14, 14[G01B]
D647096 Memory cardNov 08, 10Oct 18, 11[1402]
D647097 Memory cardNov 12, 10Oct 18, 11[1402]
7394147 Semiconductor packageFeb 09, 05Jul 01, 08[H01L]
7115978 Package StructureOct 06, 04Oct 03, 06[H01L]
6847111 Semiconductor device with heat-dissipating capabilityOct 10, 03Jan 25, 05[H01L]
6600216 Structure of a pin platform for integrated circuitMay 06, 02Jul 29, 03[H01L]
6033934 Semiconductor chip fabrication method and apparatus thereforDec 09, 97Mar 07, 00[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0038,839 MICRO PROJECTOR MODULEAbandonedOct 07, 10Feb 16, 12[G02F]
7576418 Lead frame structure and applications thereofExpiredJul 03, 08Aug 18, 09[H01L]
2009/0189,295 STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedMay 13, 08Jul 30, 09[H01L]
2008/0304,245 SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATEAbandonedOct 19, 07Dec 11, 08[B23K, H05K]
2008/0230,531 HEAT BLOCKAbandonedAug 27, 07Sep 25, 08[H05B]
2008/0113,472 Film and chip packaging process using the sameAbandonedNov 08, 07May 15, 08[H01L, B32B]
2007/0205,493 Semiconductor package structure and method for manufacturing the sameAbandonedJun 12, 06Sep 06, 07[H01L]
2006/0097,129 Lens module structureAbandonedNov 10, 04May 11, 06[H01J, H01L]
2004/0183,179 Package structure for a multi-chip integrated circuitAbandonedMar 20, 03Sep 23, 04[H01L]
2004/0168,287 Pressing apparatus for a semiconductor deviceAbandonedDec 24, 03Sep 02, 04[B23P]
2004/0082,159 Fabrication method for solder bump pattern of rear section wafer packageAbandonedMar 10, 03Apr 29, 04[H01L]
2004/0032,021 Structure of a heat dissipation finAbandonedMay 14, 03Feb 19, 04[H01L]
6677185 Method of affixing a heat sink to a substrate and package thereofExpiredJun 03, 02Jan 13, 04[H01L]
2003/0164,303 Method of metal electro-plating for IC package substrateAbandonedNov 07, 02Sep 04, 03[C25D]
2003/0160,316 Open-type multichips stack packagingAbandonedJan 13, 03Aug 28, 03[H01L]
2003/0160,320 High heat dissipation micro-packaging body for semiconductor chipAbandonedJul 18, 02Aug 28, 03[H01L]
6608391 Preparation method of underfill for flip chip package and the deviceExpiredJun 05, 02Aug 19, 03[H01L]
2003/0110,608 Pressing kit for substrate or lead frame of a semiconductor packagingAbandonedJun 24, 02Jun 19, 03[B23P]
2003/0111,724 Inspection device for inspecting the position of trademark on integrated circuitAbandonedMay 29, 02Jun 19, 03[H01L]
2003/0106,866 Heat sinks holding kit and storage rack for semiconductor chipAbandonedJul 18, 02Jun 12, 03[A47F]

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