OHTOMO CHEMICAL IND., CORP.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
C10M LUBRICATING COMPOSITIONS 148

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6221814 Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluidNov 12, 99Apr 24, 01[C10M]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2003/0100,455 Aqueous grinding fluid for wire-sawing or band-sawingAbandonedMay 12, 00May 29, 03[C10M]
6422067 Slurry useful for wire-saw slicing and evaluation of slurryExpiredAug 11, 00Jul 23, 02[G01N, B23D]
6001265 Recovery of coolant and abrasive grains used in slicing semiconductor wafersExpiredFeb 14, 97Dec 14, 99[B01D]
5693596 Cutting fluid, method for production thereof, and method for cutting ingotExpiredOct 23, 95Dec 02, 97[C10M]

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