NOVELLUS SYSTEMS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 514100
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 17713
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1671
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 8811
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 399
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 3029
 
  
 
H05H PLASMA TECHNIQUE 297
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 252
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 2364
 
  
 
C25B ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR 2213

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0102,416 LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROLDec 14, 15Apr 14, 16[C25D]
2014/0235,069 MULTI-PLENUM SHOWERHEAD WITH TEMPERATURE CONTROLJul 03, 13Aug 21, 14[H01L, F28F]
2013/0319,329 PLASMA-ACTIVATED DEPOSITION OF CONFORMAL FILMSAug 09, 13Dec 05, 13[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905423 Soft landing nanolaminates for advanced patterningJun 08, 16Feb 27, 18[C23C, H01L]
9899230 Apparatus for advanced packaging applicationsAug 08, 16Feb 20, 18[C25D, H01L, G03F, B44C]
9873946 Multi-station sequential curing of dielectric filmsJan 09, 15Jan 23, 18[C23C, H01L]
9856574 Monitoring leveler concentrations in electroplating solutionsMar 04, 16Jan 02, 18[C25D, G01N]
9852913 Wetting pretreatment for enhanced damascene metal fillingJan 09, 15Dec 26, 17[C23C, C25D, H01L]
9834852 Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingOct 12, 16Dec 05, 17[C25D, G01N]
9835388 Systems for uniform heat transfer including adaptive portionsDec 28, 12Dec 05, 17[H01L, F28F]
9828688 Methods and apparatus for wetting pretreatment for through resist metal platingJun 13, 16Nov 28, 17[C25D, H01L]
9822461 Dynamic current distribution control apparatus and method for wafer electroplatingNov 28, 12Nov 21, 17[C25D, H01L]
9816193 Configuration and method of operation of an electrodeposition system for improved process stability and performanceDec 13, 11Nov 14, 17[C25D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0030,766 PEDESTAL BOTTOM CLEAN FOR IMPROVED FLUORINE UTILIZATION AND INTEGRATED SYMMETRIC FORELINEAbandonedJul 25, 13Jan 29, 15[C23C, H01L]
2014/0302,689 METHODS AND APPARATUS FOR DIELECTRIC DEPOSITIONAbandonedApr 09, 14Oct 09, 14[H01L]
2014/0216,336 METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTSAbandonedApr 03, 14Aug 07, 14[H01L]
2014/0209,026 PLASMA ACTIVATED DEPOSITION OF A CONFORMAL FILM ON A SUBSTRATE SURFACEAbandonedApr 02, 14Jul 31, 14[C23C]
2014/0199,497 METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACESAbandonedJan 14, 13Jul 17, 14[B05D]
2014/0127,912 PLASMA PROCESS ETCH-TO-DEPOSITION RATIO MODULATION VIA GROUND SURFACE DESIGNAbandonedNov 08, 12May 08, 14[H01L]
2014/0120,733 LOW DAMAGE PHOTORESIST STRIP METHOD FOR LOW-K DIELECTRICSAbandonedOct 29, 13May 01, 14[H01L]
2014/0094,038 ENHANCING ADHESION OF CAP LAYER FILMSAbandonedSep 13, 13Apr 03, 14[H01L]
2014/0080,324 MULTI-STATION SEQUENTIAL CURING OF DIELECTRIC FILMSAbandonedNov 21, 13Mar 20, 14[H01L]
2014/0069,459 METHODS AND APPARATUS FOR CLEANING DEPOSITION CHAMBERSAbandonedOct 17, 12Mar 13, 14[B08B, H05H]
2014/0053,867 PLASMA CLEAN METHOD FOR DEPOSITION CHAMBERAbandonedOct 30, 13Feb 27, 14[B08B]
2014/0049,162 DEFECT REDUCTION IN PLASMA PROCESSINGAbandonedAug 15, 12Feb 20, 14[H05H]
2014/0030,444 HIGH PRESSURE, HIGH POWER PLASMA ACTIVATED CONFORMAL FILM DEPOSITIONAbandonedJul 29, 13Jan 30, 14[C23C]
2014/0014,522 PHOTORESIST-FREE METAL DEPOSITIONAbandonedJul 23, 13Jan 16, 14[C25D]
2014/0001,050 ELECTROPLATING APPARATUSES AND METHODS EMPLOYING LIQUID PARTICLE COUNTER MODULESAbandonedJun 18, 13Jan 02, 14[C25D]
2013/0323,930 Selective Capping of Metal Interconnect Lines during Air Gap FormationAbandonedMay 29, 12Dec 05, 13[H01L]
2013/0316,094 RF-POWERED, TEMPERATURE-CONTROLLED GAS DIFFUSERAbandonedMay 23, 13Nov 28, 13[C23C, F24H]
2013/0237,063 SPLIT PUMPING METHOD, APPARATUS, AND SYSTEMAbandonedMar 01, 13Sep 12, 13[H01L]
2013/0206,725 CREATION OF OFF-AXIS NULL MAGNETIC FIELD LOCUS FOR IMPROVED UNIFORMITY IN PLASMA DEPOSITION AND ETCHINGAbandonedMar 16, 10Aug 15, 13[C23C, C23F]
2013/0157,466 SILICON NITRIDE FILMS FOR SEMICONDUCTOR DEVICE APPLICATIONSAbandonedFeb 13, 13Jun 20, 13[H01L]

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