NIPPON VENTURE BUSINESS CAPITAL CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7045388 Semiconductor device provided with low melting point metal bumpsAug 27, 97May 16, 06[H01L]
7045389 Method for fabricating a semiconductor devices provided with low melting point metal bumpsAug 04, 00May 16, 06[H01L]
6884708 Method of partially plating substrate for electronic devicesMay 19, 99Apr 26, 05[H01L, H05K]
6571007 Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging methodJul 30, 99May 27, 03[G06K]
5899376 Transfer of flux onto electrodes and production of bumps on electrodesJul 09, 96May 04, 99[B23K]
5765744 Production of small metal bumpsJul 09, 96Jun 16, 98[B23K]

Expired/Abandoned/Withdrawn Patents

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