NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 30332
 
  
 
C22C ALLOYS 1854
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1479
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM10147
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 866
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 794
 
  
 
H01M PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY 7147
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 546
 
  
 
B21B ROLLING OF METAL 428
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 4116

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0365,576 BONDING WIRE FOR SEMICONDUCTOR DEVICEDec 11, 15Dec 21, 17[H01L, B23K]
2017/0259,366 LEAD-FREE SOLDER BUMP JOINING STRUCTUREOct 30, 15Sep 14, 17[B23K, C22C]
2017/0040,281 BONDING WIRE FOR SEMICONDUCTOR DEVICEApr 21, 15Feb 09, 17[H01L, B23K, B32B, C22C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9902134 Metal foil for base material and producing method thereofNov 16, 11Feb 27, 18[C23C, H01L, B21D, B32B, C22C]
9905817 Resin-metal composite seal container and method for producing sameFeb 21, 13Feb 27, 18[H01M, H01G]
9887172 Bonding wire for semiconductor deviceSep 17, 15Feb 06, 18[H01L, C22C]
9812421 Bonding wire for semiconductor devicesDec 04, 14Nov 07, 17[H01L, B23K, C22C]
9773748 Bonding wire for semiconductor deviceDec 28, 15Sep 26, 17[H01L, H01B]
9718688 Carbon plate and composite carbon plateMar 20, 14Aug 01, 17[C01B, H01M]
9719185 Resin-coated stainless steel foil, container and secondary batteryJul 28, 06Aug 01, 17[C25D, H01M, B32B]
9682535 Reinforcing method and reinforcing structure for steel structure and elastic layer forming material for reinforcing steel structureNov 12, 14Jun 20, 17[C09J, C08G, B62D, E02B, E04G, C08L, B32B]
9616411 High Al-content steel sheet excellent in workability and method of production of sameApr 15, 15Apr 11, 17[C23C, C25D, B23K, B01J, C21D, B01D, B21B, C22C]
9543266 Bonding wire for semiconductor device use and method of production of sameMar 31, 15Jan 10, 17[H01L, H01B, B21C, C22F, C22C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8501088 Solder alloy, solder ball and electronic member having solder bumpExpiredDec 30, 08Aug 06, 13[C22C]
2012/0038,042 LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMPAbandonedApr 12, 10Feb 16, 12[H01L, C22C]

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