NINGBO SUNNY OPOTECH CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 31211
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 16189
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9147
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 3122
 
  
 
G06T IMAGE DATA PROCESSING OR GENERATION, IN GENERAL 2133
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
H04M TELEPHONIC COMMUNICATION 2161
 
  
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 1109
 
  
 
G03B APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR 196
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0035,021 Camera Module and Molded Circuit Board Assembly and Manufacturing Method ThereofDec 21, 16Feb 01, 18[H04N, H05K]
2017/0264,799 Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereofMar 20, 16Sep 14, 17[H04N]
2017/0244,872 Camera Module Based on Molding Technique and Molded Circuit Unit and Manufacturing Method ThereofMar 01, 16Aug 24, 17[H04N, H05K]
2017/0176,705 Adjustable Optical Lens and Camera Module and Aligning Method ThereofFeb 29, 16Jun 22, 17[H04N, G02B]
2017/0094,257 Light-deflection Three-dimensional Imaging Device and Projection Device, and Application ThereofMay 06, 15Mar 30, 17[F21V, H04N, G02B]
2016/0094,841 3D Test Chart, Adjusting Arrangement, Forming Method and Adjusting Method ThereofSep 30, 15Mar 31, 16[H04N]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9906700 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceMar 30, 17Feb 27, 18[H04M, H01L, H04N, G02B, H05K]
9900487 Camera module and array camera module based on integral packaging technologyJun 19, 17Feb 20, 18[H04N, G02B, H05K]
9894772 Manufacturing method of molded photosensitive assembly for electronic deviceMar 15, 17Feb 13, 18[H04N, B29C, G02B, B29L, H05K]
9876948 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofMar 16, 17Jan 23, 18[H01L, H04N]
9876949 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereofMar 16, 17Jan 23, 18[H01L, H04N]
9848109 Camera module and array camera module based on integral packaging technologyJun 19, 17Dec 19, 17[H01L, H04N]
9826132 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceMar 30, 17Nov 21, 17[H04M, H01L, H04N, G02B, H05K]
9781323 Camera module and manufacturing method thereofApr 07, 16Oct 03, 17[H01L, H04N, H05K]
9781324 Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic deviceMar 15, 17Oct 03, 17[H04N, G02B, H05K]
9781325 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic deviceMar 29, 17Oct 03, 17[H04N, G02B, H05K]

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