NIHON SUPERIOR CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1083
 
  
 
C22C ALLOYS 1062
 
  
 
C22B PRODUCTION OR REFINING OF METALS 325
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 250
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C09J ADHESIVES; ADHESIVE PROCESSES IN GENERAL 154
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0136,732 NANOPARTICLE PRODUCTION METHOD, PRODUCTION DEVICE AND AUTOMATIC PRODUCTION DEVICEJul 11, 13May 19, 16[B22F]
2016/0032,424 SOLDER ALLOY AND JOINT THEREOFMar 12, 14Feb 04, 16[B23K, C22C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9339893 Lead-free solder alloyApr 16, 12May 17, 16[B23K, C22C, H05K]
8999519 Solder jointOct 20, 08Apr 07, 15[B23K, B32B, C22C, H05K]
8652269 Flux composition and soldering paste compositionSep 25, 09Feb 18, 14[B23K]
8557021 Method of regulating nickel concentration in lead-free solder containing nickelFeb 22, 08Oct 15, 13[B23K, C22C]
8163061 compounds and recovery of tinJul 20, 09Apr 24, 12[C22B]
8147746 Apparatus for precipitation/separation of excess copper in lead-free solderDec 14, 06Apr 03, 12[C22B]
7861909 Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bathJul 19, 06Jan 04, 11[B23K]
7591873 compounds and recovery of tinJul 25, 06Sep 22, 09[C22B]
6936219 Lead-free alloyJul 07, 02Aug 30, 05[C22C]
6699306 Control method for copper density in a solder dipping bathOct 23, 01Mar 02, 04[C22C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0224,861 WIRE SOLDER, METHOD OF FEEDING THE SAME, AND APPARATUS AND SYSTEM THEREFORAbandonedApr 16, 14Aug 14, 14[B23K]
2012/0286,026 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFORAbandonedMay 11, 12Nov 15, 12[B23K]
2012/0280,020 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFORAbandonedMay 11, 12Nov 08, 12[B23K]
2011/0272,454 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFORAbandonedJan 14, 10Nov 10, 11[B23K]
5772101 Wave soldering machineExpiredAug 05, 96Jun 30, 98[B23K, H05K]

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