NEPES CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 10352
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 177
 
  
 
C08K USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS 1101
 
  
 
C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS 1115
 
  
 
C09B ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES; MORDANTS; LAKES 142

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9793251 Semiconductor package and manufacturing method thereofNov 30, 15Oct 17, 17[H01L]
9754892 Stacked semiconductor package and manufacturing method thereofDec 28, 12Sep 05, 17[H01L]
9653397 Semiconductor package and method of manufacturing the sameSep 25, 15May 16, 17[H01L]
9564411 Semiconductor package and method of manufacturing the sameDec 28, 12Feb 07, 17[H01L]
9502391 Semiconductor package, fabrication method therefor, and package-on packageMay 09, 13Nov 22, 16[H01L]
8759436 Transparent color coating composition containing nanosize dispersed pigments, coated substrate and method for preparing sameDec 31, 09Jun 24, 14[C08J, C09B, C08L, C08K]
7491572 Method for fabricating an image sensor mounted by mass reflowSep 30, 04Feb 17, 09[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0069,564 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEAbandonedSep 02, 16Mar 09, 17[H01L]
2016/0293,580 SYSTEM IN PACKAGE AND METHOD FOR MANUFACTURING THE SAMEAbandonedNov 24, 15Oct 06, 16[H01L]
7170170 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor packageExpiredOct 29, 04Jan 30, 07[H01L]

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