NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 8354
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2203
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9773684 Method of manufacturing fan out wafer level packageOct 29, 15Sep 26, 17[H01L]
9653378 Heat dissipation solution for advanced chip packagesMay 04, 15May 16, 17[H01L, H05K]
9638875 Optical communication apparatus and method of assembling the sameJun 16, 15May 02, 17[G02B]
9589786 Method for polishing a polymer surfaceApr 17, 15Mar 07, 17[H01L]
9583418 Chip embedded package method and structureJun 23, 14Feb 28, 17[H01L]
9368376 Mechanical debonding method and systemApr 15, 14Jun 14, 16[H01L]
9316793 Oblique angle optical fiber assemblyAug 28, 14Apr 19, 16[G02B]
9293368 Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishingSep 11, 14Mar 22, 16[H01L]
9177929 Techniques for fabricating fine-pitch micro-bumpsMay 13, 14Nov 03, 15[H01L]
9076699 TSV backside reveal structure and exposing processNov 04, 13Jul 07, 15[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0099,423 TSV Wafer Thinning Controlling Method and SystemAbandonedApr 15, 14Apr 09, 15[B24B]
2015/0035,147 Fine Pitch stud POP Structure and MethodAbandonedApr 15, 14Feb 05, 15[H01L]
2014/0370,703 TSV Front-top Interconnection ProcessAbandonedMay 07, 14Dec 18, 14[H01L]

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