Mimasu Semiconductor Industry Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 157

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7659212 Process control method in spin etching and spin etching apparatusMar 22, 04Feb 09, 10[H01L]
7364616 Wafer demounting method, wafer demounting device, and wafer demounting and transferring machineMay 13, 03Apr 29, 08[H01L]
6810888 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanismNov 05, 03Nov 02, 04[B08B]
6672318 Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanismAug 29, 00Jan 06, 04[B05C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0269,903 PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON SUBSTRATE AND POLYCRYSTALLINE SILICON SUBSTRATEAbandonedNov 28, 08Oct 28, 10[H01L]
2010/0101,726 PROCESS CONTROL METHOD IN SPIN ETCHING AND SPIN ETCHING APPARATUSAbandonedDec 01, 09Apr 29, 10[C23F]
2009/0266,414 PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE FOR SOLAR APPLICATION AND ETCHING SOLUTIONAbandonedApr 20, 07Oct 29, 09[C09K, H01L]
2009/0166,780 PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE FOR SOLAR APPLICATION AND ETCHING SOLUTIONAbandonedFeb 27, 09Jul 02, 09[H01L]
2009/0032,498 Spin Processing Method And ApparatusAbandonedMar 30, 05Feb 05, 09[B08B, C23F]
2009/0032,188 SINGLE-WAFER PROCESSORAbandonedNov 10, 04Feb 05, 09[H01L]
2008/0128,085 Surface Treating Apparatus For Square Wafer For Solar BatteryAbandonedDec 01, 04Jun 05, 08[B05C, B08B, F26B, C23F]
2008/0048,279 Process for Producing Semiconductor Substrate, Semiconductor Substrate for Solar Application and Etching SolutionAbandonedOct 26, 05Feb 28, 08[C09K, H01L]
2007/0007,245 Silicon wafer reclamation method and reclaimed waferAbandonedAug 24, 04Jan 11, 07[C03C, C23F, B44C]
6001265 Recovery of coolant and abrasive grains used in slicing semiconductor wafersExpiredFeb 14, 97Dec 14, 99[B01D]
5839425 Method for cutting a workpiece with a wire sawExpiredSep 30, 97Nov 24, 98[B28D]
5715807 Wire sawExpiredApr 04, 96Feb 10, 98[B28D]
5693596 Cutting fluid, method for production thereof, and method for cutting ingotExpiredOct 23, 95Dec 02, 97[C10M]

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