Microbonds, Inc.
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jul 11, 2013 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 67 Total Citation Count
- Nov 20, 2002 Earliest Filing
- 5 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
- No Technology to Display
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Recent Publications
- No Recent Publications to Display
Recent Patents
- No Recent Patents to Display
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7360675 Wire bonder for ball bonding insulated wire and method of using sameExpiredDec 07, 04Apr 22, 08[B23K]
6896170 Wire bonder for ball bonding insulated wire and method of using sameExpiredNov 20, 02May 24, 05[B23K]
2004/0124,545 High density integrated circuits and the method of packaging the sameAbandonedDec 15, 03Jul 01, 04[H01L]
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