MULTEK TECHNOLOGIES LIMITED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 16140
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 159

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0339,788 SPLIT VIA SECOND DRILL PROCESS AND STRUCTUREJun 07, 16Nov 23, 17[H05K]
2017/0271,734 EMBEDDED CAVITY IN PRINTED CIRCUIT BOARD BY SOLDER MASK DAMMar 31, 16Sep 21, 17[H01P, H05K]
2017/0238,416 DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTUREMar 08, 16Aug 17, 17[H05K]
2016/0278,208 SELECTIVE SEGMENT VIA PLATING PROCESS AND STRUCTUREAug 24, 15Sep 22, 16[H05K]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9867290 Selective segment via plating process and structureAug 24, 15Jan 09, 18[H05K]
9763327 Selective segment via plating process and structureAug 24, 15Sep 12, 17[H05K]
9736947 Nano-copper via fill for enhanced thermal conductivity of plated through-hole viaDec 16, 14Aug 15, 17[H05K]
9723713 Flexible printed circuit board hingeMay 14, 15Aug 01, 17[H05K]
9661743 Flexible circuit board and method of fabricatingDec 09, 14May 23, 17[H05K]
9565748 Nano-copper solder for filling thermal viasOct 27, 14Feb 07, 17[H05K]
9549463 Rigid to flexible PC transitionMay 14, 15Jan 17, 17[H05K]
9433084 Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diametersOct 10, 12Aug 30, 16[H05K]
9232630 Method of making an inlay PCB with embedded coinJan 29, 13Jan 05, 16[H05K]
8302301 Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diametersMar 08, 11Nov 06, 12[H01K]

Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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