MK ELECTRON CO., LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C22C ALLOYS 765
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 390
 
  
 
B22D CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES 247
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 250
 
  
 
H01M PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY 2152
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 136
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0346,085 NEGATIVE ELECTRODE ACTIVE MATERIAL AND METHOD OF PREPARING THE SAMEMay 23, 17Nov 30, 17[H01M, B22F, B22D, C22C]
2016/0256,962 LEAD-FREE SOLDER HAVING LOW MELTING POINTFeb 16, 16Sep 08, 16[H01L, B23K, C22C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9391039 Solder balls and semiconductor device employing the sameJul 30, 14Jul 12, 16[H01L, H01B]
9156111 Lead free solder bumpsDec 02, 14Oct 13, 15[H01L, B23K]
8716860 Tin-based solder ball and semiconductor package including the sameDec 13, 12May 06, 14[H01L]
7670548 Lead free solder containing Sn, Ag and BiJan 25, 08Mar 02, 10[C22C]
7250135 Pb-free solder alloyOct 18, 05Jul 31, 07[C22C]
6700199 Gold-silver bonding wire for semiconductor deviceMar 07, 03Mar 02, 04[H01L, C22F, C22C]
6312498 Method of manufacturing solder ballsDec 14, 99Nov 06, 01[B22F, B22D]
5993735 Gold-based alloy for bonding wire of semiconductor deviceMay 29, 98Nov 30, 99[C22C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0315,040 CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGEAbandonedApr 21, 16Oct 27, 16[H01L]
2016/0244,891 SOLDER BALL FOR FLUXLESS BONDING, METHOD OF MANUFACTURING THE SAME, AND METHOD OF FORMING SOLDER BUMPAbandonedFeb 23, 16Aug 25, 16[C23C, C25D, B23K]
2015/0072,235 POWDER MANUFACTURING APPARATUS AND ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY MANUFACTURED BY THE APPARATUSAbandonedDec 30, 13Mar 12, 15[C23C, B02C, H01M]
2015/0064,293 METAL BALL FABRICATING APPARATUSAbandonedAug 29, 14Mar 05, 15[B22F]
2015/0041,707 NEGATIVE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAMEAbandonedNov 22, 13Feb 12, 15[H01M]
2014/0332,716 ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY, AND SECONDARY BATTERY INCLUDING SAMEAbandonedJul 25, 14Nov 13, 14[H01M]
2014/0291,574 ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD FOR MANUFACTURING SAMEAbandonedJun 13, 14Oct 02, 14[H01M]
2014/0284,794 TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAMEAbandonedNov 07, 12Sep 25, 14[H01L, B23K]
2014/0203,207 ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAMEAbandonedJan 22, 13Jul 24, 14[C01B, H01M]
2014/0199,594 ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTURING THE SAMEAbandonedJan 16, 13Jul 17, 14[H01M]
2014/0023,928 ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND SECONDARY BATTERY INCLUDING THE SAMEAbandonedOct 31, 12Jan 23, 14[B02C, H01M]
8022541 Au-Ag based alloy wire for semiconductor packageExpiredMay 23, 07Sep 20, 11[H01L]
2008/0240,975 AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGEAbandonedMar 19, 08Oct 02, 08[C22C]
2008/0230,915 SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOYAbandonedMar 19, 08Sep 25, 08[H01L]
2006/0251,538 Au alloy bonding wireAbandonedMay 05, 06Nov 09, 06[C22C]
2006/0186,544 Copper bonding wire for semiconductor packagingAbandonedOct 18, 05Aug 24, 06[H01L]
6991854 Gold alloy bonding wire for semiconductor deviceExpiredJul 24, 03Jan 31, 06[C22C]
6569378 Apparatus for manufacturing solder ballsExpiredSep 26, 01May 27, 03[B22F]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.