MITSUBISHI MATERIALS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 13319
 
  
 
C22C ALLOYS 1269
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 120244
 
  
 
B23B TURNING; BORING 1176
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 8612
 
  
 
B23C MILLING 744
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6296
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 6123
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 608
 
  
 
C01B NON-METALLIC ELEMENTS; COMPOUNDS THEREOF5426

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0071,839 ROUGHING END MILLMar 23, 16Mar 15, 18[B23C]
2018/0066,355 Cu-Ga ALLOY SPUTTERING TARGET AND METHOD OF MANUFACTURING Cu-Ga ALLOY SPUTTERING TARGETMar 10, 16Mar 08, 18[C23C, B22F, C22C]
2018/0056,403 DRILLMar 08, 16Mar 01, 18[B23B]
2018/0051,384 PLATING SOLUTION USING SULFONIUM SALTMar 24, 16Feb 22, 18[C25D]
2018/0040,533 MANUFACTURING METHOD FOR JUNCTION, MANUFACTURING METHOD FOR SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD FOR HEAT SINKMar 02, 16Feb 08, 18[H01L]
2018/0033,515 SILVER POWDER, PASTE COMPOSITION, AND METHOD OF PRODUCING SILVER POWDERJan 25, 16Feb 01, 18[H01B, B22F]
2018/0033,950 PIEZOELECTRIC PTZT FILM, AND PROCESS FOR PRODUCING LIQUID COMPOSITION FOR FORMING SAID PIEZOELECTRIC FILMFeb 15, 16Feb 01, 18[H01L, C04B, C01G]
2018/0016,674 DEPOSITION APPARATUS AND METHOD FOR MANUFACTURING COATED CUTTING TOOLJan 30, 15Jan 18, 18[C23C, B23C]
2018/0012,684 METHOD FOR PRODUCING INSULATED ELECTRIC WIREFeb 05, 16Jan 11, 18[C25D, C09D, H01B]
2018/0005,731 SUPERCONDUCTING WIRE AND SUPERCONDUCTING COILDec 22, 15Jan 04, 18[H01B, H01F, B22D, C22C]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9914663 Manufacturing facility for quicklime, and manufacturing facility and manufacturing process for slaked limeNov 21, 11Mar 13, 18[C04B]
9901456 Vertebral body spacerNov 09, 11Feb 27, 18[A61F]
9901991 DrillAug 20, 14Feb 27, 18[B23B]
9903013 Thermistor made of metal nitride material, method for producing same, and film type thermistor sensorNov 27, 13Feb 27, 18[C23C, G01K, H01C]
9903014 Surface-coated cutting toolMar 18, 14Feb 27, 18[C23C, B23C]
9905341 Metal nitride material for thermistor, method for producing same, and film type thermistor sensorFeb 26, 13Feb 27, 18[G01K, H01C, C30B]
9905342 Thermistor method made of metal nitride material, method for producing same, and film type thermistor sensorNov 28, 13Feb 27, 18[C23C, G01K, H01C]
9905417 Composition for forming ferroelectric thin film, and method for manufacturing sameMay 14, 14Feb 27, 18[H01L, C09D]
9905437 Method of producing bonded body and method of producing power module substrateAug 18, 14Feb 27, 18[H01L, B23K, C22C]
9890080 Cement plantJan 19, 12Feb 13, 18[C04B, F27B, F27D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0095,835 METHOD FOR FORMING LaNiO3 THIN FILMAbandonedMar 18, 15Apr 06, 17[H01L, B05D, C01G, H01G]
2017/0028,481 DRILL INSERT AND INDEXABLE DRILLAbandonedDec 17, 14Feb 02, 17[B23B]
2016/0290,874 TEMPERATURE SENSORAbandonedFeb 13, 14Oct 06, 16[G01K, H01C]
2016/0260,591 SPUTTERING TARGET AND METHOD OF PRODUCING SPUTTERING TARGETAbandonedApr 16, 15Sep 08, 16[H01J, C23C, B22F]
2016/0254,268 LANIO3 THIN-FILM-FORMING COMPOSITION, AND METHOD FOR FORMING LANIO3 THIN-FILM IN WHICH SAID COMPOSITION IS USEDAbandonedOct 06, 14Sep 01, 16[H01L, C09D]
2016/0214,183 CUTTING TOOLAbandonedSep 12, 14Jul 28, 16[B23B]
2016/0193,668 INSERT FOR DRILL AND CUTTING BLADE REPLACEMENT-TYPE DRILLAbandonedMar 25, 14Jul 07, 16[B23B]
2016/0152,481 PRIMARY DISTILLATION BORON REDUCTIONAbandonedDec 01, 14Jun 02, 16[C01B, B01J]
2016/0118,165 METAL NITRIDE MATERIAL FOR THERMISTOR, METHOD FOR PRODUCING SAME, AND FILM TYPE THERMISTOR SENSORAbandonedMay 26, 14Apr 28, 16[C23C, C01B, H01C]
2016/0056,025 CYLINDRICAL SPUTTERING TARGET AND METHOD FOR MANUFACTURING SAMEAbandonedMar 27, 14Feb 25, 16[H01J, C23C, B22D, C22C]
2016/0016,265 Au-Sn-Bi ALLOY POWDER PASTE, Au-Sn-Bi ALLOY THIN FILM, AND METHOD FOR FORMING Au-Sn-Bi ALLOY THIN FILMAbandonedNov 27, 13Jan 21, 16[B23K, C22C]
2015/0343,569 SN-AG-CU-BASED SOLDER POWDER AND SOLDER PASTE USING SAID POWDERAbandonedJan 21, 14Dec 03, 15[B23K, H05K, C22C]
2015/0348,664 COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICES, COMPONENT FOR ELECTRONIC AND ELECTRIC DEVICES, AND TERMINALAbandonedDec 20, 13Dec 03, 15[H01B, C22C]
2015/0316,509 METHOD FOR MEASURING THICKNESS OF BOILER WATER TUBEAbandonedFeb 06, 14Nov 05, 15[G01N]
2015/0308,009 PHOSPHOROUS-CONTAINING COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FOR MANUFACTURING SAME, AND ELECTROLYTIC COPPER PLATING METHODAbandonedJan 07, 11Oct 29, 15[C25D, C22F, C22C]
2015/0308,874 AIRFLOW SENSORAbandonedNov 21, 13Oct 29, 15[G01F]
2015/0211,108 SPUTTERING TARGET AND PRODUCING METHOD THEREOFAbandonedAug 08, 13Jul 30, 15[C23C, B22F, C22C]
2015/0197,838 THERMO-MECHANICAL PROCESS TO ENHANCE THE QUALITY OF GRAIN BOUNDARY NETWORKS IN METAL ALLOYSAbandonedApr 22, 14Jul 16, 15[C22F]
2015/0184,302 TIN-PLATED COPPER-ALLOY TERMINAL MATERIALAbandonedDec 04, 14Jul 02, 15[C23C, H01B]
2015/0187,452 COPPER ALLOY WIRE AND COPPER ALLOY WIRE MANUFACTURING METHODAbandonedJul 31, 12Jul 02, 15[H01B, C22F, C22C]

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