MICROSS ADVANCED INTERCONNECT TECHNOLOGY LLC

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 19343
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 7198
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 363
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 357
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 292
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
C22C ALLOYS 171
 
  
 
C30B SINGLE-CRYSTAL GROWTH 155
 
  
 
E21B EARTH OR ROCK DRILLING 195
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 177

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9881905 Electronic packages with three-dimensional conductive planes, and methods for fabricationApr 20, 15Jan 30, 18[H01L]
9576889 Three-dimensional electronic packages utilizing unpatterned adhesive layerJun 25, 13Feb 21, 17[H01L]
9437796 Rare earth-doped materials with enhanced thermoelectric figure of meritDec 21, 12Sep 06, 16[H01L, H01F, C22C]
9257335 Electronic devices utilizing contact pads with protrusions and methods for fabricationSep 04, 13Feb 09, 16[H01L]
9022649 Fluorescence based thermometryOct 05, 12May 05, 15[G01K]
8975753 Three dimensional interconnect structure and method thereofMar 03, 10Mar 10, 15[H01L]
8671560 In system reflow of low temperature eutectic bond ballsMar 30, 10Mar 18, 14[H05K]
8486765 Structure and process for electrical interconnect and thermal managementSep 21, 11Jul 16, 13[H01L]
8404585 Preventing breakage of long metal signal conductors on semiconductor substratesJul 07, 11Mar 26, 13[H01L]
8361901 Die bonding utilizing a patterned adhesion layerApr 05, 10Jan 29, 13[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0318,593 NANOPARTICLE COMPACT MATERIALS FOR THERMOELECTRIC APPLICATIONAbandonedNov 21, 12Oct 30, 14[H01L]
2014/0144,971 In System Reflow of Low Temperature Eutectic Bond BallsAbandonedJan 29, 14May 29, 14[H01L]
8541884 Through-substrate via having a strip-shaped through-hole signal conductorExpiredJun 28, 12Sep 24, 13[H01L]
6972889 Mems electrostatically actuated optical display device and associated arraysExpiredJun 27, 02Dec 06, 05[G02B]
6924921 Layered photonic crystalsExpiredDec 22, 03Aug 02, 05[G02B]
6906598 Three dimensional multimode and optical coupling devicesExpiredDec 31, 02Jun 14, 05[H01P]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.