MDS CO. LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
  
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 145
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8828247 Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the sameAug 20, 12Sep 09, 14[H01B]
7815481 Plasma display panel, method of manufacturing electrode burying dielectric wall of display panel and method of manufacturing electrode burying dielectric wall of the plasma display panelFeb 13, 07Oct 19, 10[H01J]
7811626 Printed circuit board and method of manufacturing the sameDec 04, 08Oct 12, 10[B05D]
7750456 Printed circuit board and method of manufacturing semiconductor package using the sameJan 10, 07Jul 06, 10[H01L]
7129719 Apparatus for detecting defect in circuit pattern and defect detecting system having the sameJun 01, 04Oct 31, 06[G01R]
7119285 Flexible printed circuit boardMar 01, 04Oct 10, 06[H05K]
6150711 Multi-layer plated lead frameFeb 19, 98Nov 21, 00[H01L]
5833783 Lead frame taping apparatus and taping methodOct 25, 96Nov 10, 98[B32B]
5747222 Multi-layered circuit substrate and manufacturing method thereofSep 11, 96May 05, 98[G03C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0192,885 METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYERAbandonedFeb 01, 13Aug 01, 13[H05K]
2013/0147,946 LENS APPARATUS FOR INSPECTING OBJECT AND MACHINE VISION SYSTEM INCLUDING THE SAMEAbandonedJul 27, 12Jun 13, 13[F21V, H04N, G02B]
2013/0105,214 METHOD FOR MANUFACTURING CIRCUIT BOARD PROVIDED WITH METAL POSTS AND CIRCUIT BOARD MANUFACTURED BY THE METHODAbandonedOct 31, 12May 02, 13[H05K]
2012/0298,409 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAMEAbandonedMar 08, 12Nov 29, 12[H05K]
7999396 Adhesive tape and semiconductor package using the sameExpiredDec 16, 09Aug 16, 11[H01L]
7952175 Lead frame, semiconductor package including the lead frame and method of forming the lead frameExpiredJul 02, 08May 31, 11[H01L]
7470461 Printed circuit board and method of manufacturing the sameExpiredOct 05, 05Dec 30, 08[B32B]
7199462 Substrate for producing semiconductor packagesExpiredMay 20, 05Apr 03, 07[H01L]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.