MATTSON THERMAL PRODUCTS GMBH

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Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355
 
  
 
F27B FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS123
 
  
 
F27D DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE 124
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
H03L AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES 179

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8450652 Apparatus for thermally treating semiconductor substratesOct 15, 08May 28, 13[H01L, F27B, F27D, C30B]
7412299 Process for determining the temperature of a semiconductor wafer in a rapid heating unitNov 28, 03Aug 12, 08[G06F]
7169717 Method of producing a calibration waferNov 13, 03Jan 30, 07[H01L]
7151060 Device and method for thermally treating semiconductor wafersJul 25, 03Dec 19, 06[H01L]
7144747 Method for thermally treating a substrate that comprises several layersJul 26, 02Dec 05, 06[H01L]
7098157 Method and apparatus for thermally treating disk-shaped substratesNov 28, 03Aug 29, 06[H01L]
7094637 Method for minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gatesOct 27, 03Aug 22, 06[H01L]
6809011 Adjusting of defect profiles in crystal or crystalline-like structuresNov 18, 02Oct 26, 04[H01L]
6051512 Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafersApr 11, 97Apr 18, 00[H03L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6965093 Device for thermally treating substratesExpiredSep 14, 01Nov 15, 05[F27B]
6775471 Method and device for thermally treating objectsExpiredMar 05, 03Aug 10, 04[F26B]

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