MATTSON TECHNOLOGY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 56306
 
  
 
F27B FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS246
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 2081
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 19109
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 1167
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 10101
 
  
 
F27D DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE 916
 
  
 
A21B BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING 712
 
  
 
F26B DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM 723
 
  
 
H05H PLASMA TECHNIQUE 723

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0053,628 Separation Grid for Plasma ChamberMay 10, 17Feb 22, 18[H01J, H01L]
2017/0372,870 Inductive Plasma SourceJul 14, 17Dec 28, 17[H01J, H05H]
2017/0243,721 Inductively Coupled Plasma Source for Plasma ProcessingMay 08, 17Aug 24, 17[H01J]
2017/0207,077 Variable Pattern Separation Grid for Plasma ChamberJan 11, 17Jul 20, 17[H01J, H01L, B08B]
2017/0194,133 Electrode Tip for ARC LampDec 15, 16Jul 06, 17[H01J, H01L, H05B, H05H]
2017/0194,163 Features for Improving Process Uniformity in a Millisecond Anneal SystemDec 14, 16Jul 06, 17[H01L, H05B]
2017/0194,175 Chamber Wall Heating for a Millisecond Anneal SystemDec 15, 16Jul 06, 17[H01L, H05B, F27D]
2017/0194,178 Substrate Support in a Millisecond Anneal SystemDec 14, 16Jul 06, 17[H01L, G01R]
2017/0194,220 Preheat Processes for Millisecond Anneal SystemDec 13, 16Jul 06, 17[H01L]
2017/0196,046 Nitrogen Injection for ARC LampsDec 15, 16Jul 06, 17[H01J, H01L, H05B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9653264 Inductively coupled plasma source for plasma processingDec 14, 11May 16, 17[H01J]
9633876 Selective reflectivity process chamber with customized wavelength response and methodMay 10, 10Apr 25, 17[H01L, F27B, F27D]
9627244 Methods and systems for supporting a workpiece and for heat-treating the workpieceDec 19, 03Apr 18, 17[H01L]
9493306 Low cost high throughput processing platformFeb 05, 14Nov 15, 16[H01L, B65G, F16H]
9482468 Repeatable heat-treating methods and apparatusSep 14, 06Nov 01, 16[H01L, G01J, F27B]
9279727 Methods, apparatus and media for determining a shape of an irradiance pulse to which a workpiece is to be exposedOct 14, 11Mar 08, 16[H01L, G01J]
9245730 Apparatus and methods for generating electromagnetic radiationFeb 24, 12Jan 26, 16[H01J]
9214319 High efficiency plasma sourceJul 30, 12Dec 15, 15[C23C, H01J, H01L, H05H]
9184072 Advanced multi-workpiece processing chamberJul 27, 07Nov 10, 15[H01L, B23P, B01J]
9070590 Workpiece breakage prevention method and apparatusMay 15, 09Jun 30, 15[H01L, C21D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0246,422 Heating Configuration for Use in Thermal Processing ChambersAbandonedMar 05, 14Sep 04, 14[H01L]
2013/0196,510 SLOTTED ELECTROSTATIC SHIELD MODIFICATION FOR IMPROVED ETCH AND CVD PROCESS UNIFORMITYAbandonedMar 08, 13Aug 01, 13[H01L]
2012/0298,039 METHOD AND APPARATUS FOR GROWING THIN OXIDE FILMS ON SILICON WHILE MINIMIZING IMPACT ON EXISTING STRUCTURESAbandonedAug 06, 12Nov 29, 12[C23C]
2012/0160,806 INDUCTIVE PLASMA SOURCEAbandonedAug 20, 10Jun 28, 12[H05H, C23F, B44C]
2010/0252,547 SYSTEM AND METHOD FOR REDUCING OBJECT DEFORMATION DURING A PULSED HEATING PROCESSAbandonedJun 21, 10Oct 07, 10[F27B, F27D]
2009/0325,386 Process and System For Varying the Exposure to a Chemical Ambient in a Process ChamberAbandonedMay 28, 09Dec 31, 09[C23C, H01L, G01F]
2009/0206,056 Method and Apparatus for Plasma Process Performance Matching in Multiple Wafer ChambersAbandonedFeb 06, 09Aug 20, 09[C23C, B05C, C23F]
7561258 Wafer tilt detection apparatus and methodExpiredMay 16, 07Jul 14, 09[H01L, G01J]
2008/0124,937 Selective etching method and apparatusAbandonedAug 16, 06May 29, 08[H01L]
2007/0269,975 System and method for removal of photoresist and stop layer following contact dielectric etchAbandonedMay 18, 06Nov 22, 07[H01L]
2006/0291,833 Switchable reflector wall conceptAbandonedMay 26, 06Dec 28, 06[F26B, A21B]
2006/0076,244 Barrier enhancement process for copper interconnectsAbandonedNov 30, 05Apr 13, 06[C25D]
2005/0268,567 Wedge-shaped window for providing a pressure differentialAbandonedJul 31, 03Dec 08, 05[E06B]
2005/0205,210 Advanced multi-pressure workpiece processingAbandonedJan 05, 05Sep 22, 05[C23F]
6884719 Method for depositing a coating having a relatively high dielectric constant onto a substrateExpiredMar 19, 02Apr 26, 05[H01L]
2005/0079,717 Systems and methods for photoresist strip and residue treatment in integrated circuit manufacturingAbandonedOct 06, 04Apr 14, 05[H01L]
6875691 Temperature control sequence of electroless plating bathsExpiredJun 21, 02Apr 05, 05[H01L]
6835278 Systems and methods for remote plasma cleanExpiredJun 29, 01Dec 28, 04[B08B, C23F]
2004/0247,787 Effluent pressure control for use in a processing systemAbandonedMar 17, 04Dec 09, 04[C23C]
2004/0238,008 Systems and methods for cleaning semiconductor substrates using a reduced volume of liquidAbandonedSep 23, 03Dec 02, 04[B08B]

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