MACROTECH TECHNOLOGY INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0091,154 SUBSTRATELESS PACKAGES WITH SCRIBE DISPOSED ON HEAT SPREADERAbandonedSep 30, 13Apr 02, 15[H01L]
2015/0048,496 FABRICATION PROCESS AND STRUCTURE TO FORM BUMPS ALIGNED ON TSV ON CHIP BACKSIDEAbandonedAug 13, 13Feb 19, 15[H01L]
2015/0048,499 FINE-PITCH PILLAR BUMP LAYOUT STRUCTURE ON CHIPAbandonedAug 16, 13Feb 19, 15[H01L]

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