LeaRonal, Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 546

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5750018 Cyanide-free monovalent copper electroplating solutionsMar 18, 97May 12, 98[C25D]
RE35513 Cyanide-free plating solutions for monovalent metalsApr 10, 96May 20, 97[C25D]
5378347 Reducing tin sludge in acid tin platingMay 19, 93Jan 03, 95[C25D]
5302278 Cyanide-free plating solutions for monovalent metalsFeb 19, 93Apr 12, 94[C25D]
5256275 Electroplated gold-copper-silver alloysApr 15, 92Oct 26, 93[C25D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6210556 Electrolyte and tin-silver electroplating processExpiredFeb 08, 99Apr 03, 01[C25D]
6071398 Programmed pulse electroplating processExpiredOct 06, 97Jun 06, 00[C25D]
5897848 Process for producing hypophosphite compoundsExpiredSep 19, 97Apr 27, 99[C01B]
5578182 Electrolytic production of hypophosphorous acidExpiredSep 01, 95Nov 26, 96[C25B]
5522972 Nickel hypophosphite manufactureExpiredJul 19, 94Jun 04, 96[C25B]
5492615 Cyclodextrin stabilization of organic metal finishing additives in aqueous metal treating bathsExpiredNov 22, 94Feb 20, 96[C23C, C25D]
5480517 Electrolytic production of hypophosphorous acidExpiredSep 16, 94Jan 02, 96[C25B]
5427677 Flux for reflowing tinplateExpiredFeb 18, 94Jun 27, 95[C25D]
5312539 Electrolytic tin plating methodExpiredJun 15, 93May 17, 94[C25D]
5174887 High speed electroplating of tinplateExpiredMay 02, 90Dec 29, 92[C25D]
5094726 Limiting tin sludge formation in tin or tin-lead electroplating solutionsExpiredSep 20, 90Mar 10, 92[C25D]
5085744 Electroplated gold-copper-zinc alloysExpiredNov 06, 90Feb 04, 92[C25D]
5066367 Limiting tin sludge formation in tin or tin/lead electroplating solutionsExpiredSep 20, 90Nov 19, 91[C25D, C25C]
4994155 High speed tin, lead or tin/lead alloy electroplatingExpiredSep 20, 89Feb 19, 91[C25D]
4919720 Electroless gold plating solutionsExpiredJun 30, 88Apr 24, 90[C23C]
4904354 Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereofExpiredNov 09, 88Feb 27, 90[C25D]
4880507 Tin, lead or tin/lead alloy electrolytes for high speed electroplatingExpiredDec 09, 88Nov 14, 89[C25D]
4877450 Formaldehyde-free electroless copper plating solutionsExpiredFeb 23, 89Oct 31, 89[C23C]
4871429 Limiting tin sludge formation in tin or tin/lead electroplating solutionsExpiredApr 29, 88Oct 03, 89[C25D]
4847114 Preparation of printed circuit boards by selective metallizationExpiredJun 01, 88Jul 11, 89[B05D]

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