LINGSEN PRECISION INDUSTRIES, LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 20342
 
  
 
H04R LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS 7100
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 330
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 230
 
  
 
F21K LIGHT SOURCES NOT OTHERWISE PROVIDED FOR139
 
  
 
F21S NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF 155
 
  
 
F21Y INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V, RELATING TO THE FORM OF THE LIGHT SOURCES 134
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 177
 
  
 
G01L MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE 155
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0063,616 MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTUREOct 27, 16Mar 01, 18[H04R, B81B]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905548 Optical module integrated packageAug 25, 16Feb 27, 18[H01L]
9705025 Package structure of an optical moduleNov 05, 13Jul 11, 17[H01L]
9647178 Package structure of optical module having printed shielding layer and its method for packagingNov 05, 13May 09, 17[H01L]
9618415 Pressure sensor packageFeb 09, 15Apr 11, 17[G01L]
9553073 Chip stack structure using conductive film bridge adhesive technologyApr 18, 14Jan 24, 17[H01L]
9478693 Optical module package and its packaging methodJan 06, 15Oct 25, 16[H01L]
9449955 Optical module integrated packageJul 22, 14Sep 20, 16[H01L]
9416930 LED lamp strip and manufacturing process thereofJan 10, 14Aug 16, 16[H01L, F21Y, F21K, F21S]
9309108 MEMS microphone packaging methodNov 03, 14Apr 12, 16[H01L, B81C, H04R]
9312402 Micro optical package structure with filtration layer and method for making the sameFeb 03, 14Apr 12, 16[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0157,024 FLIP-CHIP MEMS MICROPHONEAbandonedFeb 13, 15Jun 02, 16[H04R]
2016/0093,556 QUAD-FLAT NON-LEAD PACKAGE STRUCTURE AND METHOD OF PACKAGING THE SAMEAbandonedNov 07, 14Mar 31, 16[H01L]
2015/0279,796 QUAD-FLAT NO-LEADS PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedJun 17, 14Oct 01, 15[H01L]
2015/0279,826 OPTICAL MODULE WITH OPTICAL CONCENTRATION STRUCTURE AND PACKAGING METHOD THEREOFAbandonedJun 17, 14Oct 01, 15[H01L]
2015/0206,852 COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAbandonedApr 25, 14Jul 23, 15[H01L, H05K]
2015/0111,324 PACKAGE STRUCTURE OF OPTICAL MODULEAbandonedDec 22, 14Apr 23, 15[H01L]
2015/0069,626 CHIP PACKAGE, CHIP PACKAGE MODULE BASED ON THE CHIP PACKAGE, AND METHOD OF MANUFACTURING THE CHIP PACKAGEAbandonedOct 29, 13Mar 12, 15[H01L]
2015/0028,357 PACKAGE STRUCTURE OF AN OPTICAL MODULEAbandonedNov 05, 13Jan 29, 15[H01L]
2015/0028,358 PACKAGE STRUCTURE OF AN OPTICAL MODULEAbandonedNov 05, 13Jan 29, 15[H01L]
2015/0028,371 PACKAGE STRUCTURE OF OPTICAL MODULEAbandonedNov 06, 13Jan 29, 15[H01L]
2014/0299,978 QUAD FLAT NON-LEAD PACKAGEAbandonedMay 30, 14Oct 09, 14[H01L]
2013/0075,764 OPTICAL MODULE PACKAGE STRUCTUREAbandonedNov 03, 11Mar 28, 13[H01L]
2012/0299,020 LED PACKAGE MODULE FOR LIGHTINGAbandonedJun 28, 11Nov 29, 12[H01L]
2012/0267,351 METHOD FOR DICING WAFER STACKAbandonedMay 24, 11Oct 25, 12[B23K]
2011/0180,924 MEMS MODULE PACKAGEAbandonedFeb 18, 10Jul 28, 11[H01L]
2010/0127,368 LEAD FRAMEAbandonedJan 29, 09May 27, 10[H01L]
2010/0096,711 MICROELECTROMECHANICAL SYSTEM MICROPHONE PACKAGEAbandonedNov 24, 08Apr 22, 10[H01L]
2009/0286,355 FLIP-CHIP PROCESS BY PHOTO-CURING ADHESIVEAbandonedNov 04, 08Nov 19, 09[H01L]
2009/0236,712 IC PACKAGE HAVING REDUCED THICKNESSAbandonedNov 04, 08Sep 24, 09[H01L]
2009/0239,339 METHOD OF STACKING DIES FOR DIE STACK PACKAGEAbandonedNov 04, 08Sep 24, 09[H01L]

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