KLA-TENCOR CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 55010
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS2347
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 152298
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 149218
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 14834
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 13984
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 13527
 
  
 
G06T IMAGE DATA PROCESSING OR GENERATION, IN GENERAL 11048
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 9911
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 96116

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0073,993 SIMULTANEOUS MULTI-DIRECTIONAL LASER WAFER INSPECTIONSep 06, 17Mar 15, 18[G06T, G01N]
2018/0068,825 Apparatus and Method for Correcting Arrayed Astigmatism in a Multi-Column Scanning Electron Microscopy SystemJul 10, 17Mar 08, 18[H01J, G01N]
2018/0059,033 Apparatus for High-Speed Imaging Sensor Data TransferAug 08, 17Mar 01, 18[H01L, H04N, G01N, G01T]
2018/0051,984 Measurement Of Multiple Patterning ParametersOct 15, 17Feb 22, 18[H01L, G01B, G03F]
2017/0309,009 Computer Assisted Weak Pattern Detection and Quantification SystemSep 26, 16Oct 26, 17[G06T]
2017/0278,694 High Brightness Laser-Sustained Plasma Broadband SourceOct 04, 16Sep 28, 17[H01J, H05H]
2017/0255,188 Methods and Systems for Creating or Performing a Dynamic Sampling Scheme for a Process During Which Measurements Are Performed on WafersMay 16, 17Sep 07, 17[G05B, G03F]
2017/0227,348 Dynamic Determination of Metal Film Thickness from Sheet Resistance and TCR ValueFeb 24, 17Aug 10, 17[G01B]
2017/0229,829 Inspection System Using 193nm LaserApr 24, 17Aug 10, 17[G01N, H01S, G02F]
2017/0219,807 Wafer Defect Inspection and Review SystemsSep 28, 16Aug 03, 17[G06T, G02B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9921050 Spectral control systemApr 13, 16Mar 20, 18[F21V, G01N, G02B, G01B]
9921104 Simultaneous multi-angle spectroscopyNov 07, 16Mar 20, 18[G01J, G01N]
9921152 Systems and methods for extended infrared spectroscopic ellipsometryOct 27, 16Mar 20, 18[G01J, G01N]
9921261 Method and apparatus for non-contact measurement of sheet resistance and shunt resistance of p-n junctionsOct 16, 14Mar 20, 18[G01R]
9922269 Method and system for iterative defect classificationJan 29, 16Mar 20, 18[H01L, G06T, G06K]
9915522 Optimized spatial modeling for optical CD metrologyJun 03, 14Mar 13, 18[G06F, G01B]
9915524 Optical metrology with small illumination spot sizeMay 11, 15Mar 13, 18[G01N, G01B, G03F]
9915622 Wafer inspectionAug 27, 15Mar 13, 18[G01N]
9915625 Optical die to database inspectionDec 27, 16Mar 13, 18[G06T, G01N]
9916653 Detection of defects embedded in noise for inspection in semiconductor manufacturingJun 27, 12Mar 13, 18[H04N, G06T, G01N, G06K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0103,517 Design Based Sampling and Binning for Yield Critical DefectsAbandonedDec 22, 16Apr 13, 17[G06T, G01N, G06K]
2017/0076,911 Wafer Defect DiscoveryAbandonedNov 22, 16Mar 16, 17[H01J]
2015/0316,411 Method and System for Intrinsic LED Heating for MeasurementAbandonedApr 29, 15Nov 05, 15[G01J, H05B]
9103665 Apparatus and method for three dimensional inspection of wafer saw marksWithdrawnApr 12, 11Aug 11, 15[H01L, G01N, G01B]
2015/0192,404 REDUCING REGISTRATION ERROR OF FRONT AND BACK WAFER SURFACES UTILIZING A SEE-THROUGH CALIBRATION WAFERAbandonedMar 18, 15Jul 09, 15[G01B]
2015/0192,459 EXTREME ULTRA-VIOLET (EUV) INSPECTION SYSTEMSAbandonedJan 05, 15Jul 09, 15[G01J, G01N]
2015/0194,565 Solid State Light Production Using Flexible Grouping Of LEDsAbandonedJan 05, 15Jul 09, 15[H01L, B07C]
2015/0176,973 A DUAL INTERFEROMETER SYSTEM WITH A SHORT REFERENCE FLAT DISTANCE FOR WAFER SHAPE AND THICKNESS VARIATION MEASUREMENTAbandonedDec 09, 11Jun 25, 15[G01B]
9007583 Multi-analyzer angle spectroscopic ellipsometryWithdrawnJul 03, 12Apr 14, 15[G01J, G01N]
2015/0069,241 Multi-Spectral Defect Inspection for 3D WafersAbandonedNov 15, 14Mar 12, 15[G01N]
2015/0020,972 PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBERAbandonedOct 02, 14Jan 22, 15[H01J, H01L]
2014/0308,456 APPARATUS AND METHOD FOR CONTROLLED DEPOSITION OF AEROSOLIZED PARTICLES ONTO A SUBSTRATEAbandonedApr 07, 14Oct 16, 14[B03C, B05D, B05B]
2014/0185,136 MULTI DIRECTIONAL ILLUMINATION FOR A MICROSCOPE AND MICROSCOPEAbandonedMar 06, 14Jul 03, 14[G02B]
2014/0168,758 CARBON AS GRAZING INCIDENCE EUV MIRROR AND SPECTRAL PURITY FILTERAbandonedMar 15, 13Jun 19, 14[G02B]
2014/0166,051 APPARATUS, SYSTEM, AND METHOD FOR SEPARATING GASES AND MITIGATING DEBRIS IN A CONTROLLED PRESSURE ENVIRONMENTAbandonedDec 13, 13Jun 19, 14[B05B]
2014/0158,894 METHOD AND DEVICE USING PHOTOELECTRONS FOR IN-SITU BEAM POWER AND STABILITY MONITORING IN EUV SYSTEMSAbandonedDec 09, 13Jun 12, 14[G21K, G01T]
2014/0158,914 OPTICAL COMPONENT WITH BLOCKING SURFACE AND METHOD THEREOFAbandonedDec 09, 13Jun 12, 14[G01N, G02B]
2014/0151,580 METHODS OF USING POLISHED SILICON WAFER STRIPS FOR EUV HOMOGENIZERAbandonedNov 18, 13Jun 05, 14[G02B]
2014/0136,164 ANALYTIC CONTINUATIONS TO THE CONTINUUM LIMIT IN NUMERICAL SIMULATIONS OF WAFER RESPONSEAbandonedMar 15, 13May 15, 14[G06F]
8670948 Numerical aperture integration for optical critical dimension (OCD) metrologyExpiredOct 19, 12Mar 11, 14[G01N]

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