KLA-TENCOR CORPORATION
Patent Owner
Stats
- 1,185 US PATENTS IN FORCE
- 70 US APPLICATIONS PENDING
- Mar 20, 2018 most recent publication
Details
- 1,185 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 31,632 Total Citation Count
- Sep 28, 1993 Earliest Filing
- 146 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2018/0068,825 Apparatus and Method for Correcting Arrayed Astigmatism in a Multi-Column Scanning Electron Microscopy SystemJul 10, 17Mar 08, 18[H01J, G01N]
2018/0059,033 Apparatus for High-Speed Imaging Sensor Data TransferAug 08, 17Mar 01, 18[H01L, H04N, G01N, G01T]
2017/0309,009 Computer Assisted Weak Pattern Detection and Quantification SystemSep 26, 16Oct 26, 17[G06T]
2017/0278,694 High Brightness Laser-Sustained Plasma Broadband SourceOct 04, 16Sep 28, 17[H01J, H05H]
2017/0255,188 Methods and Systems for Creating or Performing a Dynamic Sampling Scheme for a Process During Which Measurements Are Performed on WafersMay 16, 17Sep 07, 17[G05B, G03F]
2017/0227,348 Dynamic Determination of Metal Film Thickness from Sheet Resistance and TCR ValueFeb 24, 17Aug 10, 17[G01B]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9921152 Systems and methods for extended infrared spectroscopic ellipsometryOct 27, 16Mar 20, 18[G01J, G01N]
9921261 Method and apparatus for non-contact measurement of sheet resistance and shunt resistance of p-n junctionsOct 16, 14Mar 20, 18[G01R]
9916653 Detection of defects embedded in noise for inspection in semiconductor manufacturingJun 27, 12Mar 13, 18[H04N, G06T, G01N, G06K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2017/0103,517 Design Based Sampling and Binning for Yield Critical DefectsAbandonedDec 22, 16Apr 13, 17[G06T, G01N, G06K]
2015/0316,411 Method and System for Intrinsic LED Heating for MeasurementAbandonedApr 29, 15Nov 05, 15[G01J, H05B]
9103665 Apparatus and method for three dimensional inspection of wafer saw marksWithdrawnApr 12, 11Aug 11, 15[H01L, G01N, G01B]
2015/0192,404 REDUCING REGISTRATION ERROR OF FRONT AND BACK WAFER SURFACES UTILIZING A SEE-THROUGH CALIBRATION WAFERAbandonedMar 18, 15Jul 09, 15[G01B]
2015/0192,459 EXTREME ULTRA-VIOLET (EUV) INSPECTION SYSTEMSAbandonedJan 05, 15Jul 09, 15[G01J, G01N]
2015/0194,565 Solid State Light Production Using Flexible Grouping Of LEDsAbandonedJan 05, 15Jul 09, 15[H01L, B07C]
2015/0176,973 A DUAL INTERFEROMETER SYSTEM WITH A SHORT REFERENCE FLAT DISTANCE FOR WAFER SHAPE AND THICKNESS VARIATION MEASUREMENTAbandonedDec 09, 11Jun 25, 15[G01B]
2015/0020,972 PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBERAbandonedOct 02, 14Jan 22, 15[H01J, H01L]
2014/0308,456 APPARATUS AND METHOD FOR CONTROLLED DEPOSITION OF AEROSOLIZED PARTICLES ONTO A SUBSTRATEAbandonedApr 07, 14Oct 16, 14[B03C, B05D, B05B]
2014/0185,136 MULTI DIRECTIONAL ILLUMINATION FOR A MICROSCOPE AND MICROSCOPEAbandonedMar 06, 14Jul 03, 14[G02B]
2014/0168,758 CARBON AS GRAZING INCIDENCE EUV MIRROR AND SPECTRAL PURITY FILTERAbandonedMar 15, 13Jun 19, 14[G02B]
2014/0166,051 APPARATUS, SYSTEM, AND METHOD FOR SEPARATING GASES AND MITIGATING DEBRIS IN A CONTROLLED PRESSURE ENVIRONMENTAbandonedDec 13, 13Jun 19, 14[B05B]
2014/0158,894 METHOD AND DEVICE USING PHOTOELECTRONS FOR IN-SITU BEAM POWER AND STABILITY MONITORING IN EUV SYSTEMSAbandonedDec 09, 13Jun 12, 14[G21K, G01T]
2014/0158,914 OPTICAL COMPONENT WITH BLOCKING SURFACE AND METHOD THEREOFAbandonedDec 09, 13Jun 12, 14[G01N, G02B]
2014/0151,580 METHODS OF USING POLISHED SILICON WAFER STRIPS FOR EUV HOMOGENIZERAbandonedNov 18, 13Jun 05, 14[G02B]
2014/0136,164 ANALYTIC CONTINUATIONS TO THE CONTINUUM LIMIT IN NUMERICAL SIMULATIONS OF WAFER RESPONSEAbandonedMar 15, 13May 15, 14[G06F]
8670948 Numerical aperture integration for optical critical dimension (OCD) metrologyExpiredOct 19, 12Mar 11, 14[G01N]
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