KINGPAK TECHNOLOGY INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 43319
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 3156
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 3125
 
  
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 2240
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
A61B DIAGNOSIS; SURGERY; IDENTIFICATION 1239
 
  
 
G01J MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY 177
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0146,396 DETECTION SYSTEM WITH QUANTUM LIGHT SOURCEJul 18, 16May 25, 17[G01J]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9905597 Sensor package structureJul 12, 17Feb 27, 18[H01L]
9184331 Method for reducing tilt of optical unit during manufacture of image sensorFeb 13, 13Nov 10, 15[H01L]
8969120 Two-stage packaging method of image sensorsOct 15, 13Mar 03, 15[H01L, G01R]
8928104 Image sensor packaging structure with black encapsulantNov 17, 10Jan 06, 15[H01L]
8847146 Image sensor package structure with casing including a vent without sealing and in communication with package materialOct 15, 09Sep 30, 14[H01J, H01L]
8828777 Wafer level image sensor packaging structure and manufacturing method of the sameJan 25, 11Sep 09, 14[H01L]
8703519 Structure and manufacturing method for high resolution camera moduleMar 12, 13Apr 22, 14[H01L]
8563350 Wafer level image sensor packaging structure and manufacturing method for the sameNov 16, 10Oct 22, 13[H01L]
8481343 Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the sameDec 07, 10Jul 09, 13[H01L, B29C, G01R]
8440488 Manufacturing method and structure for wafer level image sensor module with fixed focal lengthNov 17, 10May 14, 13[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0365,965 UNIVERSAL CONNECTION RECOGNITION SYSTEMAbandonedJul 29, 16Dec 21, 17[H01R, A61B, G01R]
8450137 Method for reducing tilt of transparent window during manufacturing of image sensorExpiredFeb 23, 12May 28, 13[H01L]
8378441 Manufacturing method and structure of a wafer level image sensor module with package structureExpiredJan 21, 11Feb 19, 13[H01L]
2009/0045,476 IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAMEAbandonedAug 16, 07Feb 19, 09[H01L]
7368795 Image sensor module with passive componentExpiredDec 22, 05May 06, 08[H01L]
2008/0067,334 Image sensor package structure and method for manufacturing the sameAbandonedNov 19, 07Mar 20, 08[H01J, H01L]
2007/0246,544 Method for manufacturing memory card structureAbandonedApr 20, 06Oct 25, 07[G06K]
2007/0241,272 Image sensor package structure and method for manufacturing the sameAbandonedApr 14, 06Oct 18, 07[H01J]
2007/0216,037 Memory card structure and method for manufacturing the sameAbandonedMar 16, 06Sep 20, 07[H01L]
2007/0210,434 Structure of stacked integrated circuits and method for manufacturing the sameAbandonedMar 08, 06Sep 13, 07[H01L]
2007/0159,543 Simplified image sensor module packageAbandonedDec 22, 05Jul 12, 07[H04N]
2007/0138,585 Image sensor packageAbandonedDec 16, 05Jun 21, 07[H01L]
2007/0138,586 Image sensor module packageAbandonedDec 16, 05Jun 21, 07[H01L]
2007/0108,544 Image sensor with a compound structureAbandonedNov 17, 05May 17, 07[H01L]
2007/0096,280 Image sensor module structure and a method for manufacturing the sameAbandonedNov 01, 05May 03, 07[H01L]
2007/0090,284 Image sensor package structureAbandonedOct 20, 05Apr 26, 07[H01J]
2007/0090,380 Image sensor structure with a connectorAbandonedOct 20, 05Apr 26, 07[H01L]
2007/0049,000 Method for re-forming BGA of a semiconductor packageAbandonedAug 26, 05Mar 01, 07[H01L]
2007/0029,655 Jig structure for manufacturin a stacked memory cardAbandonedAug 02, 05Feb 08, 07[H01L]
2006/0289,980 Stacked memory card and method for manufacturing the sameAbandonedJun 22, 05Dec 28, 06[H01L]

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