JX NIPPON MINING & METALS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 19312
 
  
 
C22C ALLOYS 1538
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6990
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 6469
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6493
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 5511
 
  
 
C22F CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS 533
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 52310
 
  
 
C22B PRODUCTION OR REFINING OF METALS 453
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 4235

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0065,862 POLYOXOMETALATE AND METHOD FOR PRODUCING POLYOXOMETALATEMar 30, 16Mar 08, 18[C01B, C25B, C01G]
2018/0063,950 COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR FABRICATING PRINTED WIRING BOARDOct 31, 17Mar 01, 18[H05K]
2018/0044,779 Fe-Pt-BASED SPUTTERING TARGET WITH DISPERSED C GRAINSOct 11, 17Feb 15, 18[C23C, H01B, G11B, B22F, C22C]
2018/0035,529 STRUCTURE HAVING METAL MATERIAL FOR HEAT RADIATION, PRINTED CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METAL MATERIAL FOR HEAT RADIATIONJul 24, 17Feb 01, 18[F28F, H05K]
2018/0019,389 MAGNETIC MATERIAL SPUTTERING TARGET AND METHOD FOR PRODUCING SAMEFeb 24, 16Jan 18, 18[C23C, H01L, H01F]
2017/0372,879 TANTALUM SPUTTERING TARGET, AND PRODUCTION METHOD THEREFORMay 17, 16Dec 28, 17[H01J, C23C, C22F, B22D]
2017/0362,733 COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUSJun 21, 17Dec 21, 17[C25D, B32B, H05K]
2017/0345,524 Roll Laminate, Method For Producing Roll Laminate, Method For Producing Laminate, Method For Producing Build-Up Substrate, Method For Producing Printed Wiring Board, And Method For Producing Electronic DeviceMay 23, 17Nov 30, 17[H01B, B32B, H05K]
2017/0347,493 Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat RadiationMay 30, 17Nov 30, 17[H05K]
2017/0306,473 Sputtering Target Comprising Al-Te-Cu-Zr-Based Alloy and Method of Manufacturing SameOct 08, 15Oct 26, 17[C23C, B22F, C22C]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922807 Sputtering target and method for production thereofMar 27, 14Mar 20, 18[H01J, C23C, B22D, C22F, C22C]
9909196 High-purity copper-cobalt alloy sputtering targetFeb 19, 14Mar 06, 18[H01J, C23C, C22F, C22C]
9911518 Cathode active material for lithium-ion battery, cathode for lithium-ion battery and lithium-ion batterySep 30, 13Mar 06, 18[H01M, H01B, C01G]
9896745 Copper alloy sputtering target and method for manufacturing the targetDec 04, 02Feb 20, 18[C23C, H01L, C22C]
9890452 Tantalum sputtering target, method for manufacturing same, and barrier film for semiconductor wiring formed by using targetMar 19, 13Feb 13, 18[C23C, H01J, H01L, C22F, B22D, C22C]
9859031 Cu—Ni—Si based copper alloyFeb 15, 13Jan 02, 18[H01B, C22F, C22C]
9859104 Tantalum sputtering target and production method thereforFeb 28, 14Jan 02, 18[C23C, H01J, C22F, C22C]
9845528 Tantalum sputtering targetAug 04, 10Dec 19, 17[C23C, C22F, C22C]
9840757 Rolled copper foil for producing two-dimensional hexagonal lattice compound and method of producing two-dimensional hexagonal lattice compoundJun 12, 15Dec 12, 17[C22F, C30B, C22C, B32B]
9834839 Cylindrical sputtering target, cylindrical compact, manufacturing method of cylindrical sputtering target, and manufacturing method of cylindrical sintered compactMar 28, 16Dec 05, 17[C23C, H01J, C04B]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0208,377 TANTALUM SPUTTERING TARGET AND METHOD FOR PRODUCING SAMEAbandonedMar 04, 15Jul 21, 16[C23C, H01J, H01L, C22F, C21D]
2016/0032,427 METHOD FOR MANUFACTURING HIGH PURITY MANGANESE AND HIGH PURITY MANGANESEAbandonedSep 08, 14Feb 04, 16[C22B, B22D, C22C]
2016/0002,749 METHOD FOR MANUFACTURING HIGH PURITY MANGANESE AND HIGH PURITY MANGANESEAbandonedSep 02, 14Jan 07, 16[C22B, C22C]
2015/0232,342 ROLLED COPPER FOIL FOR PRODUCING GRAPHENE AND METHOD OF PRODUCING GRAPHENE USING THE SAMEAbandonedJul 08, 13Aug 20, 15[C01B, C23F, C22C]
2015/0232,980 Cu-Ga Alloy Sputtering Target, and Method for Producing SameAbandonedOct 28, 13Aug 20, 15[C23C, H01J, B22D, C22C]
2015/0170,890 Sputtering TargetAbandonedSep 13, 13Jun 18, 15[H01J, C23C, G11B]
2015/0107,991 Fe-Pt-Based Sputtering Target Having Nonmagnetic Substance Dispersed ThereinAbandonedAug 21, 13Apr 23, 15[H01J, C23C]
2015/0047,469 Method for Recovering Rare Earth from Rare Earth Element-Containing AlloyAbandonedJul 11, 13Feb 19, 15[C22B, C25C]
2015/0014,155 Ferromagnetic Material Sputtering Target Containing Chromium OxideAbandonedJan 15, 13Jan 15, 15[H01J, C23C]
2014/0339,466 Cathode Active Material For Lithium Ion Battery, Cathode For Lithium Ion Battery, And Lithium Ion BatteryAbandonedMay 29, 13Nov 20, 14[H01M]
2014/0318,973 ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPPER FOILAbandonedMar 28, 12Oct 30, 14[H01M]
2014/0311,899 Ferromagnetic Material Sputtering TargetAbandonedJan 21, 13Oct 23, 14[H01J]
2014/0246,399 COPPER FOIL FOR PRODUCING GRAPHENE, PRODUCTION METHOD THEREOF AND METHOD OF PRODUCING GRAPHENEAbandonedOct 26, 12Sep 04, 14[C01B, B32B, B21B, C25F]
2014/0231,250 C PARTICLE DISPERSED FE-PT-BASED SPUTTERING TARGETAbandonedDec 18, 12Aug 21, 14[C23C]
2014/0199,203 HIGH-PURITY LANTHANUM, METHOD FOR PRODUCING SAME, SPUTTERING TARGET COMPRISING HIGH-PURITY LANTHANUM, AND METAL GATE FILM COMPRISING HIGH-PURITY LANTHANUM AS MAIN COMPONENTAbandonedSep 04, 12Jul 17, 14[C23C, C22B, C22C]
2014/0166,481 Fe-Al Based Alloy Sputtering TargetAbandonedApr 26, 12Jun 19, 14[C23C]
2014/0158,546 ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROWIRING OF COPPER FOR ULSIAbandonedDec 10, 13Jun 12, 14[C25D]
2014/0110,849 Copper-Titanium Alloy Sputtering Target, Semiconductor Wiring Line Formed Using the Sputtering Target, and Semiconductor Element and Device Each Equipped with the Semiconductor Wiring LineAbandonedFeb 15, 12Apr 24, 14[C23C, H01L]
2014/0113,121 METAL FOIL COMPOSITE, FLEXIBLE PRINTED CIRCUIT, FORMED PRODUCT AND METHOD OF PRODUCING THE SAMEAbandonedMar 08, 12Apr 24, 14[B32B, H05K]
2014/0083,847 Fe-Pt-C Based Sputtering TargetAbandonedJul 20, 12Mar 27, 14[C23C]

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