JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

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Patent Activity in the Last 10 Years

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H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 11351

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0163,622 PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOFDec 03, 13Jun 09, 16[H01L]
2016/0141,233 FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-IN-PACKAGE METAL CIRCUIT BOARD STRUCTURE AND PROCESSING METHOD THEREOFJan 07, 14May 19, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9640413 Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofDec 02, 13May 02, 17[H01L]
9633985 First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereofJan 08, 14Apr 25, 17[H01L]
9627303 Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological methodDec 02, 13Apr 18, 17[H01L]
9362214 Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the sameMar 12, 14Jun 07, 16[H01L]
9252113 No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the sameApr 22, 14Feb 02, 16[H01L]
9209115 Quad flat no-lead (QFN) packaging structure and method for manufacturing the sameApr 24, 14Dec 08, 15[H01L]
9209117 No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the sameMay 28, 14Dec 08, 15[H01L]
9105622 Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the sameMay 06, 14Aug 11, 15[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0148,861 FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-IN-PACKAGE STRUCTURE AND PROCESSING METHOD THEREFORAbandonedDec 19, 13May 26, 16[H01L]
2008/0315,412 Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameAbandonedApr 06, 06Dec 25, 08[H01L]
2008/0285,251 Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameAbandonedApr 06, 06Nov 20, 08[H01R, H05K]
2008/0258,273 Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameAbandonedApr 06, 06Oct 23, 08[H01L]

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