J-DEVICES CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 40322
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
G11C STATIC STORES 1150
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0358,462 MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGEJun 13, 17Dec 14, 17[H01L]
2017/0263,560 Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect StructureJan 30, 17Sep 14, 17[H01L]
2017/0256,453 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGEJan 19, 17Sep 07, 17[H01L]
2017/0207,157 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGEDec 12, 16Jul 20, 17[H01L]
2017/0170,106 WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOFDec 01, 16Jun 15, 17[H01L]
2016/0233,141 SEMICONDUCTOR DEVICEFeb 08, 16Aug 11, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922931 Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structureJan 30, 17Mar 20, 18[H01L]
9905536 Semiconductor deviceJan 13, 16Feb 27, 18[H01L]
9837382 Semiconductor package and manufacturing method thereofApr 04, 16Dec 05, 17[H01L]
9786611 Method for manufacturing a semiconductor packageAug 12, 16Oct 10, 17[H01L]
9721900 Semiconductor package and its manufacturing methodNov 30, 16Aug 01, 17[H01L]
9685376 Semiconductor device and method of manufacturing semiconductor deviceJul 16, 15Jun 20, 17[H01L]
9635762 Semiconductor packageJul 20, 15Apr 25, 17[H01L, H05K]
9627289 Semiconductor deviceDec 09, 15Apr 18, 17[H01L]
9601450 Semiconductor packageMar 26, 15Mar 21, 17[H01L]
9595488 Semiconductor deviceJan 29, 16Mar 14, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0373,012 SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAMEAbandonedMay 03, 17Dec 28, 17[H01L]
2015/0243,576 SEMICONDUCTOR DEVICEAbandonedFeb 12, 15Aug 27, 15[H01L]
2013/0256,865 SEMICONDUCTOR MODULEAbandonedFeb 27, 13Oct 03, 13[H01L]
2013/0026,650 SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOFAbandonedJul 24, 12Jan 31, 13[H01L]

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