Innovative Micro Technology

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 33329
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 1282
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 1121
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 825
 
  
 
A61M DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY 3151
 
  
 
B01L CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE 355
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
C12M APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY 346
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 3203
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 3202

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0075,994 CONTACT SURFACE FOR MEMS DEVICESep 08, 17Mar 15, 18[H01H]
2017/0237,228 MICROFABRICATED OPTICAL APPARATUSSep 22, 16Aug 17, 17[H01S, H04J]
2017/0146,793 MICROFABRICATED OPTICAL APPARATUS WITH INTEGRATED TURNING SURFACENov 18, 16May 25, 17[B81C, G02B, B81B, G03F]
2017/0126,323 MICROFABRICATED OPTICAL APPARATUSJan 18, 17May 04, 17[B81C, H04B, G02B, B81B, H01S]
2017/0062,165 DEVICE WITH SEPARATION LIMITING STANDOFFAug 10, 16Mar 02, 17[H01H]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9608731 Microfabricated optical apparatusNov 04, 15Mar 28, 17[H04B, G02B, H01S]
9533877 Anodic bonding of dielectric substratesApr 14, 16Jan 03, 17[H01L, B81C, B81B]
9493877 Etching technique for microfabrication substratesMay 02, 16Nov 15, 16[H01J, B81C, C23F, G03F]
9388037 Device using glass substrate anodic bondingJan 19, 14Jul 12, 16[B81C, B81B, B32B]
9330874 Solder bump sealing method and deviceAug 11, 14May 03, 16[H01H]
9324613 Method for forming through substrate vias with tethersFeb 11, 15Apr 26, 16[H01L, B81C]
9315375 Method using glass substrate anodic bondingDec 27, 13Apr 19, 16[B81C, B81B, B32B]
9302905 Method for forming a microfabricated structureJun 15, 15Apr 05, 16[H01L, B81C]
9274180 Microfabricated magnetic field transducer with flux guideJul 29, 13Mar 01, 16[G01R]
9162878 Wafer level hermetic bond using metal alloy with raised feature and wetting layerMar 02, 14Oct 20, 15[H01L, B81C]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0217,767 THROUGH SUBSTRATE VIAS USING SOLDER BUMPSAbandonedJan 26, 17Aug 03, 17[B81C]
2017/0062,159 MEMS REED SWITCH DEVICEAbandonedAug 15, 16Mar 02, 17[H01H]
2016/0343,684 THERMOCOMPRESSION BONDING WITH RAISED FEATUREAbandonedMay 09, 16Nov 24, 16[H01L]
2016/0093,530 METHOD FOR FORMING THROUGH SUBSTRATE VIASAbandonedSep 29, 14Mar 31, 16[H01L, B81C]
2015/0069,618 Method for forming through wafer viasAbandonedSep 11, 13Mar 12, 15[H01L]
2013/0199,730 Wafer bonding chamber with dissimilar wafer temperaturesAbandonedFeb 08, 12Aug 08, 13[B32B]
2012/0164,718 Removable/disposable apparatus for MEMS particle sorting deviceAbandonedMay 06, 08Jun 28, 12[B23P, C12M, H05K]
2012/0132,522 Deposition/bonding chamber for encapsulated microdevices and method of useAbandonedJan 11, 08May 31, 12[C23C, H01L]
7759152 MEMS thermal actuator and method of manufactureExpiredMar 10, 09Jul 20, 10[H01L]
2009/0001,537 Gettering material for encapsulated microdevices and method of manufactureAbandonedJun 27, 07Jan 01, 09[H01L]
2008/0318,349 Wafer level hermetic bond using metal alloyAbandonedAug 18, 08Dec 25, 08[H01L]
2008/0250,785 Micromechanical device with gold alloy contacts and method of manufactureAbandonedApr 16, 07Oct 16, 08[F01B]
2008/0169,521 MEMS structure using carbon dioxide and method of fabricationAbandonedJan 12, 07Jul 17, 08[H01L]
2008/0006,850 System and method for forming through wafer vias using reverse pulse platingAbandonedJul 10, 06Jan 10, 08[H01L]
2007/0207,584 Method and apparatus for curing epoxy-based photoresist using a continuously varying temperature profileAbandonedMar 01, 06Sep 06, 07[H01L]
2007/0096,860 Compact MEMS thermal device and method of manufactureAbandonedNov 02, 05May 03, 07[H01H]
2007/0048,887 Wafer level hermetic bond using metal alloyAbandonedAug 26, 05Mar 01, 07[H01L]
2006/0278,942 Antistiction MEMS substrate and method of manufactureAbandonedJun 14, 05Dec 14, 06[C23C, H01L]
2006/0266,692 Microfabricated cross flow filter and method of manufactureAbandonedMay 25, 05Nov 30, 06[B01D]
6831380 Low inertia latching microactuatorExpiredJan 17, 01Dec 14, 04[H02K, H01F]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.