ISOLA USA CORP.
Patent Owner
Stats
- 52 US PATENTS IN FORCE
- 4 US APPLICATIONS PENDING
- Nov 21, 2017 most recent publication
Details
- 52 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 897 Total Citation Count
- Jun 06, 1986 Earliest Filing
- 21 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
2014/0024,278 Synthesized Resins and Varnishes and Prepegs and Laminates Made TherefromMar 15, 13Jan 23, 14[C09D]
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
9822227 High Tg epoxy formulation with good thermal propertiesJun 18, 15Nov 21, 17[C08J, C09J, C08G, C09D, C08L, H05K, B32B]
9764532 Prepregs including UV curable resins useful for manufacturing semi-flexible PCBsAug 27, 15Sep 19, 17[B32B, H05K]
8871870 Synthesized resins and varnishes and prepegs and laminates made therefromMar 15, 13Oct 28, 14[C08F, C08C, C09D, C08K]
8313836 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agentSep 02, 11Nov 20, 12[C08L, B32B, H05K, C08K]
8263225 Laminate composition for producing reduced curl flat thin core laminateJun 01, 04Sep 11, 12[D03D, B32B]
8227084 Thermosetting resin composition for high performance laminatesMay 04, 10Jul 24, 12[C08L, B32B]
8129456 Flame retardant compositions with a phosphorated compoundNov 08, 05Mar 06, 12[C07F, C08G, C08K]
8022140 Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agentDec 11, 06Sep 20, 11[C08L, B32B, C08K]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2014/0220,844 Prepregs and Laminates Having Homogeneous Dielectric PropertiesAbandonedMar 14, 13Aug 07, 14[H01B]
2013/0230,727 Copolymer of Styrene and Maleic Anhydride Comprising an Epoxy Resin Composition and Co-Cross-Linking AgentAbandonedSep 28, 12Sep 05, 13[C08G, H05K]
2012/0289,113 Thermosetting Resin Compositions For High Performance LaminatesAbandonedJul 23, 12Nov 15, 12[C09D, B32B]
2007/0178,300 Laminates for high speed and high frequency printed circuit boardsAbandonedDec 06, 06Aug 02, 07[G11B, B32B]
6955740 Production of laminates for printed wiring boards using protective carrierExpiredJan 10, 02Oct 18, 05[B32B]
5162450 Curable dielectric polyphenylene ether-polyepoxide compositionsExpiredJan 03, 90Nov 10, 92[C08L]
5141791 Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefromExpiredJun 27, 90Aug 25, 92[B32B]
5142151 Method for measuring degree of cure of resin in a composite material and process for making the sameExpiredOct 16, 90Aug 25, 92[G01N]
5098781 Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substratesExpiredDec 28, 90Mar 24, 92[B32B]
5096771 Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene etherExpiredAug 10, 90Mar 17, 92[B32B]
5073605 Bromine-bisphenol reacted bisphenol and novolak epoxy resins with polyphenylene etherExpiredFeb 26, 90Dec 17, 91[C08L]
4767643 Method of continuously vacuum impregnating fibrous sheet materialExpiredJul 22, 86Aug 30, 88[C23C, B05D]
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