IQLP, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM1156
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 177

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8728606 Thermoplastic materialApr 14, 10May 20, 14[B32B]
RE43807 Microcircuit package having ductile layerJan 12, 12Nov 20, 12[H01L]
8039945 Plastic electronic component packageNov 19, 10Oct 18, 11[H01L]
7803307 Ultra high-temperature plastic package and method of manufactureJun 07, 05Sep 28, 10[C08J, C08G]
7736573 Thermoplastic materialAug 18, 04Jun 15, 10[B29C]
7679185 Microcircuit package having ductile layerNov 09, 07Mar 16, 10[H01L]
7053299 Flange for integrated circuit packageAug 18, 04May 30, 06[H01L]
6867367 Package for integrated circuit dieJan 29, 04Mar 15, 05[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0305,279 ULTRA HIGH-TEMPERATURE PLASTIC PACKAGE AND METHOD OF MANUFACTUREAbandonedAug 13, 10Dec 02, 10[C08G]
2008/0305,355 Plastic electronic component packageAbandonedJul 25, 08Dec 11, 08[F16J, B32B]
2008/0150,064 Plastic electronic component packageAbandonedDec 12, 07Jun 26, 08[H01L]
2008/0150,104 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGEAbandonedOct 19, 07Jun 26, 08[H01L]
2008/0111,148 Led reflective packageAbandonedNov 09, 07May 15, 08[H01L]
7253365 Die package for connection to a substrateExpiredJun 29, 04Aug 07, 07[H01L]
2007/0071,268 Packaged microphone with electrically coupled lidAbandonedMar 02, 06Mar 29, 07[H04R]
2007/0040,231 Partially etched leadframe packages having different top and bottom topologiesAbandonedJan 24, 06Feb 22, 07[H01L]
7135768 Hermetic sealExpiredSep 06, 01Nov 14, 06[H01L]
6977432 Prefabricated semiconductor chip carrierExpiredJan 13, 04Dec 20, 05[H01L]
6857173 Apparatus for and method of manufacturing a semiconductor die carrierExpiredNov 06, 00Feb 22, 05[B23P, H05K]
2005/0016,750 Methods for enclosing a thermoplastic packageAbandonedAug 18, 04Jan 27, 05[H05K]
2005/0012,186 Lead for integrated circuit packageAbandonedAug 18, 04Jan 20, 05[H01L]
6828511 Prefabricated semiconductor chip carrierExpiredSep 28, 01Dec 07, 04[H05K]
6797882 Die package for connection to a substrateExpiredOct 18, 01Sep 28, 04[H01L]
6709891 Open-cavity semiconductor die packageExpiredAug 30, 02Mar 23, 04[H01L]
6475832 Open-cavity semiconductor die packageExpiredSep 13, 01Nov 05, 02[H01L]
2002/0019,174 Integrated connector and semiconductor die packageAbandonedOct 16, 01Feb 14, 02[H01R]
6339191 Prefabricated semiconductor chip carrierExpiredMar 11, 94Jan 15, 02[H01L]
6305987 Integrated connector and semiconductor die packageExpiredFeb 12, 99Oct 23, 01[H01R]

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