INVENSAS CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 66770
 
  
 
G11C STATIC STORES 11666
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9568
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 40407
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2667
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 12147
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1140
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11122
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 824
 
  
 
H03K PULSE TECHNIQUE 8123

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0068,930 SSI PoPSep 20, 17Mar 08, 18[H01L]
2018/0040,587 Vertical Memory Module Enabled by Fan-Out Redistribution LayerAug 04, 17Feb 08, 18[H01L]
2018/0040,589 MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERSAug 03, 16Feb 08, 18[H01L, G11C]
2018/0026,007 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIASSep 08, 17Jan 25, 18[H01L, H05K]
2017/0250,161 Correction Die for Wafer/Die StackFeb 29, 16Aug 31, 17[H01L]
2017/0186,474 DUAL-CHANNEL DIMMDec 28, 15Jun 29, 17[G11C]
2017/0179,081 FLIPPED DIE STACKS WITH MULTIPLE ROWS OF LEADFRAME INTERCONNECTSNov 22, 16Jun 22, 17[H01L]
2017/0170,121 EMBEDDED VIALESS BRIDGESNov 17, 16Jun 15, 17[H01L]
2017/0170,341 INTEGRATED CIRCUIT DEVICEDec 22, 16Jun 15, 17[H01L]
2017/0154,875 Multiple bond via arrays of different wire heights on a same substrateFeb 13, 17Jun 01, 17[H01L, B81B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9917042 2.5D microelectronic assembly and method with circuit structure formed on carrierMay 05, 16Mar 13, 18[H01L]
9917073 Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the packageJun 29, 16Mar 13, 18[H01L]
9911717 Stackable microelectronic package structuresMar 16, 15Mar 06, 18[H01L, B81C]
9911718 ‘RDL-First’ packaged microelectronic device for a package-on-package deviceNov 16, 16Mar 06, 18[H01L]
9905507 Circuit assemblies with multiple interposer substrates, and methods of fabricationJun 14, 16Feb 27, 18[H01L, H05K]
9905523 Microelectronic assemblies formed using metal silicide, and methods of fabricationJul 06, 16Feb 27, 18[H01L]
9905537 Compact semiconductor package and related methodsNov 23, 16Feb 27, 18[H01L]
9899281 Integrated circuits protected by substrates with cavities, and methods of manufactureSep 14, 16Feb 20, 18[H01L]
9899442 Image sensor deviceNov 18, 15Feb 20, 18[H01L]
9893030 Reliable device assemblyJul 18, 16Feb 13, 18[H01L, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0186,730 SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIESAbandonedMay 11, 16Jun 29, 17[H01L]
9496242 Stackable microelectronic package structuresWithdrawnMar 16, 15Nov 15, 16[H01L, B81C]
2016/0260,671 MICROELECTRONIC PACKAGE WITH CONSOLIDATED CHIP STRUCTURESAbandonedMay 17, 16Sep 08, 16[H01L]
9418879 Low cost interposer and method of fabricationWithdrawnMar 14, 13Aug 16, 16[H01L]
2016/0218,088 SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLYAbandonedMar 31, 16Jul 28, 16[H01L]
2015/0371,938 BACK-END-OF-LINE STACK FOR A STACKED DEVICEAbandonedJun 19, 14Dec 24, 15[H01L]
2015/0295,151 HIGH PERFORMANCE LIGHT EMITTING DIODE WITH VIASAbandonedAug 23, 14Oct 15, 15[H01L]
2015/0262,902 INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METHODS OF MANUFACTUREAbandonedMar 14, 14Sep 17, 15[H01L]
2015/0263,252 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESAbandonedJun 01, 15Sep 17, 15[H01L]
9117827 Making electrical components in handle wafers of integrated circuit packagesWithdrawnMay 02, 14Aug 25, 15[H01L]
2015/0228,633 FRONT FACING PIGGYBACK WAFER ASSEMBLYAbandonedDec 15, 14Aug 13, 15[H01L]
2015/0171,027 HIGH YIELD SUBSTRATE ASSEMBLYAbandonedAug 23, 14Jun 18, 15[H01L]
2015/0076,714 MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACEAbandonedSep 16, 13Mar 19, 15[H01L]
2015/0056,753 Semiconductor Die Having Fine Pitch Electrical InterconnectsAbandonedSep 08, 14Feb 26, 15[H01L]
2015/0017,763 Microelectronic Assembly With Thermally and Electrically Conductive UnderfillAbandonedSep 29, 14Jan 15, 15[H01L]
8670261 Stub minimization using duplicate sets of signal terminalsExpiredApr 09, 13Mar 11, 14[G11C]
8659139 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateExpiredApr 04, 12Feb 25, 14[H01L, H05K]
8659140 Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrateExpiredApr 04, 12Feb 25, 14[H01L, H05K]
2014/0008,676 OPTICAL ENHANCEMENT OF LIGHT EMITTING DEVICESAbandonedJul 03, 12Jan 09, 14[H01L]
2013/0247,372 MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICEAbandonedMay 17, 13Sep 26, 13[H05K]

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