INSTITUTE OF NATIONAL COLLEGES OF TECHNOLOGY, JP

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Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0157,612 HEAT RADIATING MEMBER, CIRCUIT BOARD USING THE HEAT RADIATING MEMBER, ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULEAbandonedMar 11, 09Jun 24, 10[F21V, F28F, H05K]

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