INSTITUTE OF MICROELECTRONICS

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355
 
  
 
G01L MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE 155
 
  
 
H03F AMPLIFIERS 182
 
  
 
H03K PULSE TECHNIQUE 1130

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6566961 Wide-band single-ended to differential converter in CMOS technologyMar 30, 01May 20, 03[H03F]
6534393 Method for fabricating local metal interconnections with low contact resistance and gate electrodes with improved electrical conductivityJan 25, 99Mar 18, 03[H01L]
6468853 Method of fabricating a shallow trench isolation structure with reduced local oxide recess near cornerAug 18, 00Oct 22, 02[H01L]
6468906 Passivation of copper interconnect surfaces with a passivating metal layerJul 14, 00Oct 22, 02[H01L]
6424044 Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallizationJan 18, 02Jul 23, 02[H01L]
6352921 Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallizationJul 19, 00Mar 05, 02[H01L]
6122975 CMOS compatible integrated pressure sensorOct 14, 98Sep 26, 00[G01L]
6121809 Accurate and tuneable active differential phase splitters in RFIC wireless applicationsMar 15, 99Sep 19, 00[H03K]
6100195 Passivation of copper interconnect surfaces with a passivating metal layerDec 28, 98Aug 08, 00[H01L]
6096604 Production of reversed flash memory deviceAug 04, 99Aug 01, 00[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6908825 Method of making an integrated circuit inductor wherein a plurality of apertures are formed beneath an inductive loopExpiredNov 14, 02Jun 21, 05[H01L]
2005/0118,822 Apparatus and process for bulk wet etch with leakage protectionAbandonedJan 11, 05Jun 02, 05[H01L]
6892060 Fully integrated self-tuned image rejection downconversion systemExpiredJun 28, 02May 10, 05[H04B]
6858459 Method of fabricating micro-mirror switching deviceExpiredMay 23, 02Feb 22, 05[H01L]
6855640 Apparatus and process for bulk wet etch with leakage protectionExpiredFeb 26, 02Feb 15, 05[H01L]
6849293 Method to minimize iso-dense contact or via gap filling variation of polymeric materials in the spin coat processExpiredMay 02, 02Feb 01, 05[B05D]
6846725 Wafer-level package for micro-electro-mechanical systemsExpiredJan 27, 03Jan 25, 05[H01L]
6808644 Capillary with glass internal surfaceExpiredMay 02, 02Oct 26, 04[C03C, B44C]
6801416 ESD protection system for high frequency applicationsExpiredAug 23, 01Oct 05, 04[H02H]
6778122 Resistor string digital to analog converter with differential outputs and reduced switch countExpiredDec 23, 02Aug 17, 04[H03M]
6765300 Micro-relayExpiredFeb 11, 02Jul 20, 04[H01L]
6762049 Miniaturized multi-chamber thermal cycler for independent thermal multiplexingExpiredJul 05, 01Jul 13, 04[C07H, C12Q, C12P, C12M]
6759319 Residue-free solder bumping processExpiredMay 17, 01Jul 06, 04[H01L]
6748019 Dynamic load-balancing between two processing means for real-time video encodingExpiredDec 02, 99Jun 08, 04[H04N]
6743713 Method of forming dual damascene pattern using dual bottom anti-reflective coatings (BARC)ExpiredMay 15, 02Jun 01, 04[H01L]
6730591 Method of using silicon rich carbide as a barrier material for fluorinated materialsExpiredJul 01, 02May 04, 04[H01L]
6727768 Relaxation CCO for PLL-based constant tuning of GM-C filtersExpiredOct 29, 02Apr 27, 04[H03B]
6716570 Low temperature resist trimming processExpiredMay 23, 02Apr 06, 04[H01L, G03F]
6717812 Apparatus and method for fluid-based cooling of heat-generating devicesExpiredFeb 19, 03Apr 06, 04[H05K]
6710438 Enhanced chip scale package for wire bond diesExpiredFeb 19, 02Mar 23, 04[H01L]

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