INDIUM CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1875
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 12350
 
  
 
C22C ALLOYS 864
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 371
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 191
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR194
 
  
 
F28F DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION 151

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0029,170 HYBRID LEAD-FREE SOLDER WIREOct 04, 17Feb 01, 18[B23K, C22C]
2017/0373,034 TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOYAug 09, 17Dec 28, 17[H01L, B23K, H01B, C22C]
2017/0271,294 SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTESMar 15, 17Sep 21, 17[H01L]
2017/0203,380 CAPILLARY BLOCKJan 20, 16Jul 20, 17[H01L, B23K]
2017/0203,393 CAPILLARY BLOCKMar 24, 17Jul 20, 17[H01L, B23K]
2015/0258,638 METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUXMar 13, 15Sep 17, 15[B23K]
2011/0265,979 THERMAL INTERFACE MATERIALS WITH GOOD RELIABILITYApr 29, 11Nov 03, 11[C09K, B23P, F28F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9875983 Nanomicrocrystallite paste for pressureless sinteringApr 29, 16Jan 23, 18[H01L]
9802274 Hybrid lead-free solder wireMar 21, 16Oct 31, 17[B23K, C22C]
9741676 Tin-indium based low temperature solder alloyJun 24, 16Aug 22, 17[H01L, B23K, H01B, C22C]
9636784 Mixed alloy solder pasteMar 10, 15May 02, 17[H01L, B23K, C22C, H05K]
9468136 Low void solder joint for multiple reflow applicationsJan 16, 14Oct 11, 16[H01L, B23K, H05K]
9260768 Lead-free solder alloys and solder joints thereof with improved drop impact resistanceDec 06, 06Feb 16, 16[C22C]
9190377 Metal coating for indium bump bondingJun 24, 11Nov 17, 15[H01L, H01B]
9175368 MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliabilityJul 05, 12Nov 03, 15[B23K, C22C]
9120930 Heat dissipating paint with high thermal radiating capabilityOct 18, 12Sep 01, 15[C09D]
9017446 Mixed alloy solder pasteMay 03, 10Apr 28, 15[H01L, B23K, H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0248,176 SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE SOLDER JOINTSAbandonedApr 01, 11Oct 04, 12[B23K]
2011/0273,847 ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYSAbandonedMay 02, 11Nov 10, 11[H05K]
2010/0116,376 ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERINGAbandonedOct 08, 09May 13, 10[B23K]
4750665 Method of producing a combination coverExpiredNov 21, 86Jun 14, 88[B23K]
4746583 Ceramic combined coverExpiredNov 21, 86May 24, 88[B32B]
4737418 Nickel clad corrosion resistant lid for semiconductor packageExpiredDec 22, 86Apr 12, 88[B32B]

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