IBIS Innotech Inc.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
F21S NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF 155
 
  
 
F21V FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR 1109
 
  
 
G09F DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS 138
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0256,479 PACKAGE STRUCTUREMay 22, 17Sep 07, 17[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9859193 Package structureMay 22, 17Jan 02, 18[H01L]
9801282 Package structureAug 10, 16Oct 24, 17[H05K]
9508634 Package structureApr 20, 16Nov 29, 16[H01L, H05K]
9451694 Package substrate structureMar 19, 15Sep 20, 16[H05K]
8985807 Electrical connector and backlight module using the sameAug 15, 12Mar 24, 15[F21V, G09F, H01R, F21S, H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0034,083 TOUCH SENSING DEVICEAbandonedDec 23, 14Feb 04, 16[G06F]
2015/0364,448 PACKAGE STRUCTUREAbandonedMar 19, 15Dec 17, 15[H01L]
2015/0060,929 CERAMIC CIRCUIT BOARD AND LED PACKAGE MODULE USING THE SAMEAbandonedFeb 03, 14Mar 05, 15[H01L, H05K]
2015/0061,814 FERRITE CIRCUIT BOARDAbandonedSep 03, 14Mar 05, 15[H01F]
2010/0301,504 METHOD OF MAKING LIGHT-GUIDING MODULEAbandonedMay 26, 09Dec 02, 10[B05D, B29D]

Top Inventors for This Owner

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