I3 ELECTRONICS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 42114
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 27335
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11122
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 7152
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 418
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 371
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2203
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 264

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9756724 Method of making a circuitized substrateOct 04, 11Sep 05, 17[B23K, H01B, H05K]
9451693 Electrically conductive adhesive (ECA) for multilayer device interconnectsAug 05, 11Sep 20, 16[H05K]
9420689 Method of making a circuitized substrateOct 20, 09Aug 16, 16[H01K, H05K]
9351408 Coreless layer buildup structure with LGA and joining layerApr 22, 10May 24, 16[H05K]
8685284 Conducting paste for device level interconnectsSep 17, 10Apr 01, 14[H01B]
8607445 Substrate having internal capacitor and method of making sameJun 14, 12Dec 17, 13[H05K]
8592299 Solder and electrically conductive adhesive based interconnection for CZT crystal attachJan 26, 12Nov 26, 13[H01L]
8541687 Coreless layer buildup structureApr 22, 10Sep 24, 13[H05K]
8536459 Coreless layer buildup structure with LGAApr 22, 10Sep 17, 13[H05K]
8499440 Method of making halogen-free circuitized substrate with reduced thermal expansionMar 02, 09Aug 06, 13[H05K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8558374 Electronic package with thermal interposer and method of making sameExpiredFeb 08, 11Oct 15, 13[H01L]
8502082 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing sameExpiredAug 31, 05Aug 06, 13[H05K]
8493173 Method of cavity forming on a buried resistor layer using a fusion bonding processExpiredApr 08, 11Jul 23, 13[H01C]
2013/0033,671 LIQUID CRYSTAL POLYMER (LCP) SURFACE LAYER ADHESION ENHANCEMENTAbandonedAug 04, 11Feb 07, 13[C09K, C23C, G01J, B05D, G01N, G01T]
2013/0025,839 THERMAL SUBSTRATEAbandonedJul 25, 11Jan 31, 13[B23P, B23K, F28F, B32B]
8288857 Anti-tamper microchip package based on thermal nanofluids or fluidsExpiredSep 17, 10Oct 16, 12[H01L]
2012/0257,343 CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTIONAbandonedApr 08, 11Oct 11, 12[B82Y, G06F, H01B, G03F, H05K]
2012/0260,063 MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEMAbandonedApr 08, 11Oct 11, 12[G06F]
2012/0243,147 LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATIONAbandonedOct 14, 10Sep 27, 12[B23K, H05K]
2012/0243,155 CONDUCTIVE METAL NUB FOR ENHANCED ELECTRICAL INTERCONNECTION, AND INFORMATION HANDLING SYSTEM UTILIZING SAMEAbandonedJan 20, 11Sep 27, 12[H01L, H05K]
2012/0228,013 DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDSAbandonedMar 07, 11Sep 13, 12[B82Y, B23K, H01B, H05K]
2012/0228,014 CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD OF MAKING SAMEAbandonedMar 08, 11Sep 13, 12[B05D, H05K]
8247703 Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrateExpiredNov 03, 10Aug 21, 12[H05K]
8240027 Method of making circuitized substrates having film resistors as part thereofExpiredJan 16, 08Aug 14, 12[H01C]
8242376 Circuitized substrates utilizing smooth-sided conductive layers as part thereofExpiredAug 11, 10Aug 14, 12[H05K]
8211790 Multilayered circuitized substrate with P-aramid dielectric layers and method of making sameExpiredMar 02, 09Jul 03, 12[H01L]
2012/0162,928 ELECTRONIC PACKAGE AND METHOD OF MAKING SAMEAbandonedOct 22, 10Jun 28, 12[H05K]
8196281 Method of applying force to electrical contacts on a printed circuit boardExpiredApr 20, 11Jun 12, 12[H01S]
2012/0112,345 HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGEAbandonedNov 04, 10May 10, 12[H01L]
8143530 Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substratesExpiredSep 17, 10Mar 27, 12[H05K]

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