H&S HIGH TECH CORP.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
C07F ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM 268
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 144
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1124
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8101527 Dicing film having shrinkage release film and method for manufacturing semiconductor package using the sameApr 12, 10Jan 24, 12[H01L]
7993417 Method of adhering a pair of membersJan 22, 07Aug 09, 11[H01L]
7968977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the sameDec 10, 04Jun 28, 11[H01L]
7768141 Dicing die attachment film and method for packaging semiconductor using sameFeb 14, 07Aug 03, 10[H01L]
7743701 Squeeze for screen printerFeb 22, 07Jun 29, 10[B05C]
7553701 Semiconductor packaging methodAug 21, 08Jun 30, 09[H01L]
7485494 Dicing die adhesive film for semiconductorApr 27, 06Feb 03, 09[H01L]
7452923 Anisotropic conductive adhesiveOct 05, 04Nov 18, 08[C08F]
7438834 Anisotropic conductive adhesive having PTC characteristicsApr 20, 05Oct 21, 08[H01B]
7408015 Reacting functionalized trialkoxysilane with polyepoxide or diamine to yield silane adductDec 19, 05Aug 05, 08[C07F]

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Expired/Abandoned/Withdrawn Patents

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