HITACHI HOKKAI SEMICONDUCTOR, LTD.
Patent Owner
Stats
- 6 US PATENTS IN FORCE
- 1 US APPLICATIONS PENDING
- Sep 28, 2010 most recent publication
Details
- 6 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 959 Total Citation Count
- Mar 13, 1992 Earliest Filing
- 43 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
Publication #
Title
Filing Date
Pub Date
Intl Class
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
6265762 Lead frame and semiconductor device using the lead frame and method of manufacturing the sameMar 18, 97Jul 24, 01[H01L]
5994762 Semiconductor integrated circuit device including boron-doped phospho silicate glass layer and manufacturing method thereofJul 26, 96Nov 30, 99[H01L]
5910010 Semiconductor integrated circuit device, and process and apparatus for manufacturing the sameFeb 18, 97Jun 08, 99[H01L]
5440541 System and method for establishing communications between subscribers based on personal number assigned to each subscriberJul 29, 93Aug 08, 95[H04J]
5219794 Semiconductor integrated circuit device and method of fabricating sameMar 13, 92Jun 15, 93[H01L]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7199469 Semiconductor device having stacked semiconductor chips sealed with a resin seal memberExpiredSep 28, 01Apr 03, 07[H01L]
6974710 Fabrication method of semiconductor integrated circuit device and testing methodExpiredSep 26, 03Dec 13, 05[G01R]
6909179 Lead frame and semiconductor device using the lead frame and method of manufacturing the sameExpiredJul 16, 01Jun 21, 05[H01L]
6897093 Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) packageExpiredJul 25, 03May 24, 05[H01L]
6887739 Method of manufacturing semiconductor package including forming a resin sealing memberExpiredJul 03, 03May 03, 05[H01L]
6800507 Semiconductor device and a method of manufacturing the sameExpiredDec 23, 02Oct 05, 04[H01L]
6787442 Method of making a semiconductor having multi-layered electrodes including nickel and phosphorus and solder formed with tin and an alkaline earth metalExpiredFeb 05, 03Sep 07, 04[H01L]
6780677 Process for mounting electronic device and semiconductor deviceExpiredAug 21, 02Aug 24, 04[H01L]
6781234 Semiconductor device having electrodes containing at least copper nickel phosphorous and tinExpiredJun 19, 02Aug 24, 04[H01L]
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