HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 995
 
  
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 244
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
C07D HETEROCYCLIC COMPOUNDS 1161
 
  
 
C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 1119
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9362223 Integrated circuit assembly with cushion polymer layerAug 18, 15Jun 07, 16[H01L]
9209128 Integrated circuit assembly with cushion polymer layerApr 01, 14Dec 08, 15[H01L]
8304149 Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentDec 07, 10Nov 06, 12[G03F]
7851128 Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentNov 29, 06Dec 14, 10[G03F]
6600053 Method of preparing photosensitive resin compositionAug 30, 01Jul 29, 03[C07D]
6514658 Photosensitive polymer composition, method for forming relief patterns, and electronic partsMar 30, 01Feb 04, 03[G03F]
6365306 Photosensitive polymer composition, method for forming relief patterns, and electronic partsFeb 06, 01Apr 02, 02[G03C, G03F]
6342333 Photosensitive resin composition, patterning method, and electronic componentsSep 23, 99Jan 29, 02[G03C, G08J, G03F]
6340546 Positive photosensitive resin composition, method of forming relief pattern, and electronic partFeb 09, 00Jan 22, 02[G03F]
6329110 Photosensitive polymer composition, method for forming relief patterns, and electronic partsNov 01, 99Dec 11, 01[G03F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7150947 Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentExpiredMay 19, 03Dec 19, 06[G03F]
6960420 Photosensitive resin composition, process for forming relief pattern, and electronic componentExpiredNov 06, 03Nov 01, 05[H05K]
6773866 Photosensitive resin composition, patterning method, and electronic componentsExpiredDec 12, 01Aug 10, 04[G03C]
6436593 Positive photosensitive resin composition, process for producing pattern and electronic partsExpiredSep 21, 00Aug 20, 02[G03F]

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