HAESUNG DS CO., LTD.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 24338
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9147
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM3154
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 249
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 2102
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
C07D HETEROCYCLIC COMPOUNDS 1161
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 135
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 173

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9671352 Reel-to-reel inspection apparatus and inspection method using the sameJul 09, 13Jun 06, 17[G01N, G06K]
9532466 Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the methodOct 24, 12Dec 27, 16[H05K]
9460986 Method of manufacturing semiconductor package substrate with limited use of film resist and semiconductor package substrate manufactured using the sameJan 05, 15Oct 04, 16[H01L]
9299588 Method of manufacturing lead frameFeb 18, 14Mar 29, 16[H01L]
9257310 Method of manufacturing circuit board and chip package and circuit board manufactured by using the methodJun 24, 13Feb 09, 16[H01L, H05K]
9171789 Lead frame, semiconductor package including the lead frame, and method of manufacturing the lead frameAug 05, 13Oct 27, 15[C25D, H01L]
9173300 Method of manufacturing printed circuit boardSep 05, 12Oct 27, 15[H05K]
9142495 Lead frame and semiconductor package manufactured by using the sameDec 03, 12Sep 22, 15[H01L]
8937378 Lead frame and semiconductor package including the sameJan 11, 12Jan 20, 15[H01L]
8846421 Method of manufacturing lead frame for light-emitting device package and light-emitting device packageMar 09, 12Sep 30, 14[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0200,506 METHOD OF PREVENTING EPOXY BLEED OUT OF LEAD FRAME AND LEAD FRAME MANUFACTURED BY USING THE SAMEAbandonedNov 27, 12Aug 08, 13[H01L]
2013/0168,349 METHOD OF FORMING VIA HOLE IN CIRCUIT BOARDAbandonedDec 26, 12Jul 04, 13[H05K]
2012/0292,092 METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED BY THE METHODAbandonedJan 04, 12Nov 22, 12[C03C, H05K]
2012/0279,775 CIRCUIT BOARD VIAHOLES AND METHOD OF MANUFACTURING THE SAMEAbandonedJul 05, 12Nov 08, 12[H05K]
7341889 Lead frame for semiconductor package and method of fabricating semiconductor packageExpiredAug 20, 04Mar 11, 08[H01L]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.