Great Wall Semiconductor Corporation

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 22340
 
 
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 1101

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2016/0308,015 MOSFET with Reduced ResistanceDec 28, 15Oct 20, 16[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9666703 Semiconductor devices with cavitiesDec 11, 15May 30, 17[H01L]
9640638 Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSONJan 22, 13May 02, 17[H01L]
9299774 Device structure and methods of forming superjunction lateral power MOSFET with surrounding LDDJul 16, 14Mar 29, 16[H01L]
9099519 Semiconductor device and method of forming junction enhanced trench power MOSFETMay 23, 12Aug 04, 15[H01L]
9018706 Monolithic MOSFET and Schottky diode for mobile phone boost converterApr 24, 14Apr 28, 15[H01L]
9006099 Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bumpJun 08, 11Apr 14, 15[H01L]
8962425 Semiconductor device and method of forming junction enhanced trench power MOSFET having gate structure embedded within trenchMay 23, 12Feb 24, 15[H01L]
8921186 Semiconductor device and method of forming high voltage SOI lateral double diffused MOSFET with shallow trench insulatorMay 15, 09Dec 30, 14[H01L]
8895430 Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumpsMar 29, 12Nov 25, 14[H01L]
8138558 Semiconductor device and method of forming low voltage MOSFET for portable electronic devices and data processing centersAug 20, 10Mar 20, 12[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0015,569 Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor DieAbandonedJul 12, 11Jan 17, 13[H01L]
2012/0205,740 Lateral Power MOSFET With Integrated Schottky DiodeAbandonedDec 24, 10Aug 16, 12[H01L]
2012/0161,248 Semiconductor Device and Method of Forming Low Voltage MOSFET for Portable Electronic Devices and Data Processing CentersAbandonedMar 07, 12Jun 28, 12[H01L]
2009/0321,784 Semiconductor Device and Method of Forming Lateral Power MOSFET with Integrated Schottky Diode on Monolithic SubstrateAbandonedJun 23, 09Dec 31, 09[H01L]
2009/0014,791 Lateral Power MOSFET With Integrated Schottky DiodeAbandonedJul 08, 08Jan 15, 09[H01L]
2008/0296,690 Metal interconnect System and Method for Direct Die AttachmentAbandonedDec 11, 04Dec 04, 08[H01L]
2008/0036,070 Bond Wireless PackageAbandonedDec 01, 04Feb 14, 08[H01L]
2006/0163,658 Monolithic MOSFET and schottky diode for mobile phone boost converterAbandonedJan 18, 06Jul 27, 06[H01L]
2006/0118,811 Bi-directional power switchAbandonedFeb 04, 04Jun 08, 06[H01L]

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